Zhanshengwei issued an announcement stating that it plans to issue shares to specific objects, with the total amount of funds raised not exceeding 3.5 billion yuan. The funds raised after deducting issuance expenses are intended to be used for RF chip manufacturing expansion projects and to supplement working capital.
As the first RF manufacturer in China to adopt the Fab-Lite business model, Zhuoshengwei is determined to promote the strategic layout of the industrialization of Xinzhuo, enhance its independent control capabilities by building its own production lines, build intelligent manufacturing capabilities for key products and processes, and coordinate the design, development and manufacturing of RF front-end products, breaking the market monopoly of international leading companies and building core competitiveness.
Currently, Zhuoshengwei is moving from a product-based company to a platform-based company, and is committed to building an "intelligent quality manufacturing" resource platform that integrates design, R&D, processes, devices, materials, and integrated optimization technologies. Through the forward-looking strategic layout of the RF filter production line, it builds long-term comprehensive advantages covering multiple dimensions such as product technology, process, cost, performance, delivery, differentiation, and efficiency improvement, and strengthens the vertical development of integrated design and manufacturing of key products.
According to the latest public information, the product categories of Zhuoshengwei's 6-inch filter production line have been fully deployed, and products such as DiFEM, L-DiFEM, and GPS modules that integrate self-produced filters have been successfully introduced to multiple brand customers and continue to increase in volume. The 12-inch IPD platform has officially entered the large-scale mass production stage, and the proportion of self-produced IPD filters used in related module products such as L-PAMiF and LFEM has reached a relatively high level. At the same time, the company has made innovative investments in 3D stacked packaging, seeking higher breakthroughs in area, cost, and performance.
