Chinese semiconductor thread II

[Tomboy]

MT has been blacklisted by the US commerce department and put into entity list in 2023. so they can't use any western IP.

Moore Threads built its graphics cards and AI accelerators on its own custom architecture called MUSA.

They aren't even referring to the same thing, CUDA/MUSA etc is software level API and has really nothing much to do with the actual hardware architecture. Moore Threads to my knowledge bought Imagination Technologies' hardware architecture patents and rights and based their first few designs on that, I haven't really been following them so I'm not sure whether their latest generation is still based on that or is completely self developed.

 

[sunnymaxi]

They aren't even referring to the same thing, CUDA/MUSA etc is software level API and has really nothing much to do with the actual hardware architecture. Moore Threads to my knowledge bought Imagination Technologies' hardware architecture patents and rights and based their first few designs on that, I haven't really been following them so I'm not sure whether their latest generation is still based on that or is completely self developed.

yeah. it was rumor they received some kind of illegal help but company has denied any wrongdoing. here are the details

It was also widely reported that China Reform attempted to take over Imagination’s governance in 2020 through an emergency board meeting. This meeting was supposedly set to appoint four nominees set by the Chinese fund as directors but was canceled after receiving significant backlash from the British government and the public.

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last year in December..

During the conference, the company's founder, chairman, and CEO Zhang Jianzhong announced on Saturday the launch of the fifth-generation GPU architecture "Huagang," along with the AI training and inference chip "Huashan" and the graphics computing chip "Lushan" based on the new architecture, which will be mass-produced and launched next year, according to the Paper.

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[tokenanalyst]

Huatian Technology invests 3 billion yuan to upgrade its advanced packaging and testing base in Nanjing!​

Huatian Technology has officially entered a phase of high-quality growth following a robust financial recovery in early 2026. The company's Q1 performance reported record operating revenue of nearly 4.8 billion yuan, marking a 34.49% year-on-year increase and a dramatic profit turnaround with net profits surging by over 568%. Looking at the full year 2025, total revenue reached 17.2 billion yuan, growing by 19.03%, while the first quarter alone accounts for almost 28% of that annual total, positioning the firm to aim for a comprehensive 20 billion yuan revenue target in 2026 driven by surging AI computing demand and semiconductor industry prosperity.

To sustain this momentum, Huatian Technology announced on May 22 an investment of 3 billion yuan to upgrade its advanced packaging and testing base in Nanjing under the "Phase II, Second Stage Industrial Base Project." Utilizing existing factory land for renovation and expansion, the project will add approximately 83,300 square meters of construction space over a two-year period running from June 2026 to May 2028. Funded entirely through self-raised capital by Huatian Nanjing, this initiative is designed to significantly expand the company's capabilities in storage integrated circuit packaging and testing, aligning with its strategic goal to keep pace with rapid industry developments.

Once completed, the new industrial base will have an annual packaging and testing capacity of approximately 430 million memory integrated circuits, generating projected revenues of 2.15 billion yuan and net profits of 126 million yuan at full production. The resulting products are tailored for diverse sectors including artificial intelligence computing power, servers, consumer electronics, smart terminals, automotive electronics, and data centers. By enhancing its technology and production scale in these critical fields, the project aims to bolster Huatian Technology's overall competitiveness and profitability, ensuring sustainable long-term development in a competitive global market.
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[tokenanalyst]

Laser Semiconductor equipment manufacturer Laipu Technology plans an A-share IPO and has conducted listing counseling​

According to the official website, Lepu Technology is committed to the innovative application of advanced laser technology in specialized subdivisions. It has launched more than 30 types of professional laser application equipment in semiconductor wafer manufacturing, packaging and testing, precision electronic manufacturing and other fields, and has more than 50 professional equipment. With independent intellectual property rights, it has developed into my country's first-class semiconductor and precision electronic process equipment manufacturing enterprise.
According to reports, the Laipu Technology National Headquarters and Integrated Circuit Equipment R&D and Manufacturing Base project has a total investment of 1.66 billion yuan, covering an area of 39 acres and a construction area of 65,000 square meters. Construction has started in October 2023 and is expected to be approved by May 2025. The parallel connection will be completed and accepted in parallel, and full production will be reached in May 2026.
The relevant person in charge of Laipu Technology said that the implementation of the project will effectively promote the progress of laser equipment and technology in my country's semiconductor field, and promote process innovation in front-end integrated circuit manufacturing, advanced laser technology application and system integration, and independent controllability and professionalism of core components. It will play a positive role in talent cultivation and other aspects.
From the perspective of ownership structure, the controlling shareholder of Laipu Technology is Dongguan Dongjun Investment Co., Ltd., with a direct shareholding ratio of 26.27%. It is indirectly controlled by serving as the executive partner of Dongguan Puying Management Consulting Partnership (Limited Partnership) The voting right ratio is 4.28%, and it controls a total of 31.05% of all voting shares of the company.
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LasTop (lapu technology) is expanding their laser wafer processing equipment into logic device manufacturing.

The company actively deployed its resources, developing and validating LIC and LIEG for customers between 2021 and 2024; it also developed and validated ultra-shallow junction laser annealing equipment (USJLA) and dynamic surface alloying equipment (DALA) for advanced logic chip manufacturing processes; and it developed laser debonding equipment for 3D integrated circuit manufacturing, which was sent to leading domestic wafer fabs for verification. These efforts strongly support breakthroughs in cutting-edge integrated circuit technologies in my country and break the long-term monopoly of international manufacturers in the domestic market.

Its products cover advanced process 3D NAND Flash memory chips, advanced process DRAM memory chips, 28nm and below advanced process logic chips, SiC power chips, trench gate IGBT power chips, advanced power management chips, mass production of BSI-CCD chips, and cutting-edge application scenarios such as the R&D of domestic HBM chip processes.

Lapu technology wafer manufacturing equipment development and manufacturing center project and the advanced packaging equipment development and manufacturing center project will focus on high-end products such as LIC, LIEG, and USJLA, while also developing new products such as laser debonding, SiC laser annealing, and dynamic surface alloying, covering emerging tracks such as advanced packaging, third-generation semiconductors, and HBM; the R&D projects will strengthen next-generation laser processes and advanced process technologies to enhance core competitiveness; and the company will consolidate its existing market foundation by optimizing marketing channels, while gradually expanding overseas business, strengthening cooperation with industry leaders, and optimizing the continuous positive cycle of "R&D-revenue-profit-R&D".​

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[tokenanalyst]

Zhongxing has invested in Chengcheng Electronics, which has completed tens of millions of yuan in financing.​

Founded in 2013, Chengcheng Electronics is a specialized and innovative enterprise in China focusing on the R&D, design, and manufacturing of components, parts, and subsystems for ion implanters used in semiconductor manufacturing. As a rare domestic supplier of ion implanter subsystems and component consumables, Chengcheng Electronics continuously deepens its cooperation with strategic clients and strengthens its industrial competitiveness in the process of localization of wafer fabs and equipment manufacturers . Currently, the company's self-developed products have entered the supply chain systems of leading domestic ion implanter equipment manufacturers and wafer fabs , filling domestic gaps in key areas of the industry chain and achieving domestic substitution of core components.

Chengcheng Electronics' products are directly used in semiconductor ion implantation equipment, including key components such as ion sources and plasma guns, as well as related metal, ceramic, and graphite consumables. These various subsystems and components work together to maintain the core operation of the ion implanter, forming a crucial part of the ion implantation equipment.

Chengcheng Electronics' product series has broken the long-standing monopoly of overseas giants such as Applied Materials (USA), Ashley (USA), and Panzer (Austria). The company's products cover 6-inch to 12-inch semiconductor processes. Simultaneously, it continues to expand into niche product categories, gradually becoming a supplier of platform-based ion implantation equipment components.

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[tokenanalyst]

Tsinghua got their grating interferometer patent approved.

 

[tphuang]

Since everyone is talking about YMTC, I noticed something interesting in this shared article about Huawei's latest AI Data center presentation.

> OceanStor Pacific全闪分布式存储以11PB/2U业界领先高容量密度

Huawei just announced a SSD storage server with 11PB using only 2 rack units, making it the most dense SSD storage system in the world currently. In fact just a last week, Dell and Kioxia announced a 2U storage server with 9.8 PB of SSD, which they touted as "an “unprecedented breakthrough and a new benchmark for storage density in a 2U server.”

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So if Huawei's new storage server uses YMTC, it would also mean YMTC's latest NAND chips are also best in class in terms of density.

It’s been that way for a while now.

you can see it from previous articles

 

[dropout003]

What's up with Sicarrier? Any updates on them after their flashy debut last year?

 

[tphuang]

My latest on the huawei enterprise SSD product for AI. Seems like they really worked on this with deepseek

https://twitter.com/i/web/status/2058502248003518513

 

[jx191]

My latest on the huawei enterprise SSD product for AI. Seems like they really worked on this with deepseek

https://twitter.com/i/web/status/2058502248003518513

I can only see their cooperation increasing in the future, we'll be seeing a lot of new impressive systems come out soon with Deepseek/Huawei cooperation making it possible.