Chinese semiconductor thread II

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tokenanalyst

Brigadier
Registered Member
The US should solve its regulatory mess before even considering forcing these chaebols to build fabs in the US. I my opinion their best bet is to create a department that streamline the regulatory requirement of building these fabs.

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And the irony is that were they need real regulation they underregulate like in the case of Boeing.
 
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gelgoog

Lieutenant General
Registered Member
daifo said:
There might be a semi conductor bubble since the US is forcing uneconomical factories to be built in the US. Only China has a legit reason to build up semi conductor factories since they are constantly be denied access to semis.
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There is likely going to be a bubble yes. These uneconomical factories are not just being built in the US. But basically everywhere outside Taiwan. At the same time Taiwan is engaging in its own huge factory expansion, you have the South Korean memory manufacturers building fabs back in South Korea after years of manufacturing memory in China, TSMC building fabs in Japan, Europe, and the US, and China basically replicating Taiwan's fab capacity in China. Since the US seems to be able to sanction production of chips in Taiwan at will as already happened to Huawei and Russia.
 
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tokenanalyst

Brigadier
Registered Member

Hunan’s 50 key projects in the electronic information manufacturing industry were released, with Sanan Semiconductor and others on the list​


On March 5, the Hunan Provincial Department of Industry and Information Technology released the "List of Key Projects for the Electronic Information Manufacturing Industry in Hunan Province in 2024". 50 projects were selected, mainly in new displays, smart terminals, new generation semiconductors, advanced computing, and artificial intelligence. , new energy batteries and other six major fields.
The projects on the list include Hunan Sanan Semiconductor Project (Phase II), Hunan Jiechuwei Semiconductor Technology Co., Ltd. 8-inch power device production line expansion project, Changsha Anmuquan Intelligent Technology Co., Ltd. high-end chip advanced packaging and testing expansion project, Changsha Huahua Shi Semiconductor Co., Ltd.’s new material R&D and testing production base construction project (Phase I), Hunan Yuemo Advanced Semiconductor Co., Ltd.’s advanced packaging project, Hunan Shunwei Power Semiconductor Co., Ltd.’s power semiconductor IGBT/silicon carbide power semiconductor module project, etc.

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tokenanalyst

Brigadier
Registered Member

Machine learning in electron beam lithography to boost photoresist formulation design for high-resolution patterning​


Institute of Nuclear and New Energy Technology, Tsinghua University, Beijing, China
Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
University of Chinese Academy of Sciences, Beijing 100049, China​

Abstract​

The reduction of the critical dimension (CD) usually improves the resolution of patterns and performance of chips. In chip manufacturing, electron beam lithography (EBL) is a promising technology for preparing sub-10 nm patterns, and its imaging resolution is primarily determined by the photoresist formulation. However, the smaller CDs are mainly achieved by optimizing process conditions, and little attention has been paid to the photoresist formulation optimization. Screening suitable photoresist formulations remains a significant challenge due to the considerable time and high cost. Herein, we report a formulation optimization technique of a metal oxide nanoparticle photoresist that combines EBL experiments with a machine learning long short-term memory (LSTM) network. Using the LSTM network, a CD photoresist evaluation model is established. Leveraging the CD model, a photoresist formulation optimizer is developed with a line width of 26 nm. The verification results demonstrate that the CDs predicted by the LSTM network are basically consistent with the EBL experimental results, and the photoresist formulations that meet the CD requirements can be screened. This work opens up a novel perspective to boost photoresist formulation design for high-resolution patterning with artificial intelligence and provides guidance for EBL experiments.

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olalavn

olalavn

Senior Member
Registered Member
ByteDance has made a move on the memory chip race

PICOHEART (SG) PTE.LTD., a subsidiary of ByteDance, has become a shareholder of Xinyuan Semiconductor (Shanghai) Co., Ltd. (hereinafter referred to as "Xinyuan Semiconductor"), holding 9.5% of the shares, ranking the third largest shareholder, ByteDance spoke People also confirmed the news, saying it was to help advance the company's development of virtual reality headsets.

they invest to ReRam technology

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W

Weaasel

Senior Member
Registered Member
Have all Chinese companies finally understood that they will likely face a total embargo from US aligned countries in terms of tech? Are they now acting accordingly and cooperatively working together to ensure that China has replacement for all materials, components, and equipment of any type that is necessary for the production of semiconductors and IC chips?
 
W

Weaasel

Senior Member
Registered Member
latenlazy said:
No they’re not. So long as alternative suppliers are there they have quick turnaround if they need to do a swap. In the meantime there’s no point bringing in production risk by preemptively switching to a provider who’s less proven (it’s not just whether you can get the material but how your client deals with complications like a defective batch). The government is financing optionality for both supplier and customer here so why not take advantage of that? The alternative will still be there when you need it.
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Is it a question of just shortage in relation to having domestic sources of capacity sufficient at present to replace suppliers

OR

Is it a question of not being able to produce the types of photoresists that are demanded in different nodes.

OR

Both

If it is the second, that's bad.

If it is the first, that can be easily resolved.
 
proelite

proelite

Junior Member
gelgoog said:
The US government is figuring out that semiconductor funding is an expensive pleasure. The price of a factory with the latest process doubles every generation. To continue at the leading edge requires continuous funding. The US market size alone does not justify building a competitive fab with enough capacity either. You will have to build a smaller fab with bad economics. And that's without considering the many other factors which make semiconductor fabrication in the US less competitive than in Asia.
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The democrat white elephant.
 
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