Ai chips are not building blocks of a skyscraper. They can still build a data center and switch to another chip
Chinese semiconductor thread II
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With a total investment of 200 million yuan, another high-end semiconductor equipment project has been launched in Hefei.
On the morning of November 4th, Hefei New Station High-tech Zone and Jiaji Environmental Control (Xi'an) Technology Co., Ltd. held a signing ceremony for a semiconductor cleaning equipment project. The project was officially launched in the New Station High-end Manufacturing Industrial Park, injecting new momentum into the development of the regional integrated circuit industry.
Jiaji Environmental Control (Xi'an) Technology Co., Ltd. is a professional equipment manufacturing enterprise focusing on the research and development and industrialization of high-end semiconductor equipment. It mainly engages in the research and application of equipment for thin film deposition, cleaning, wafer transfer, and wafer storage. Among these, its wet cleaning equipment has been successfully applied in large-scale 12-inch wafer fabs.
The signed project has a total investment of 200 million yuan and is planned to be located in the Xinzhan High-end Manufacturing Industrial Park. It will focus on the research and development and manufacturing of advanced process wet cleaning equipment. Once completed, it will further consolidate the industrial foundation of Xinzhan High-tech Zone in the field of semiconductor equipment, help create a leading integrated circuit industry cluster in China, and provide stronger support for the high-quality development of the integrated circuit industry in Hefei and even the Yangtze River Delta.
Subsidies and incentives should be tied to the amount of domestically produced integrated circuits, tools, materials, and software used.
Private capital can buy whatever it wants, although the government should recommend that they domesticate their supply chains as much as possible, given the risk of being placed on export control lists by the United States and its vassals.
Zhonggui Technology showcases its 6-panel 12-inch high-end CMP equipment at SEMIEXPO Vietnam 2025
Hangzhou Zhonggui Electronics Technology Co., Ltd. (hereinafter referred to as "Zhonggui Technology") will make a brilliant appearance at the SEMIEXPO Vietnam 2025 Semiconductor Expo held in Hanoi, Vietnam from November 7th to 8th, 2025, as a national high-tech enterprise and a specialized and innovative "little giant" enterprise, showcasing its technical strength and innovative achievements in the field of chemical mechanical planarization/polishing (CMP) equipment to the Southeast Asian market.
Founded in May 2018, Zhonggui Technology is located in Qingshan Lake Science and Technology City, Hangzhou West Science and Technology Innovation Corridor. It is an innovative enterprise that focuses on the research, development, manufacturing and sales of high-end semiconductor equipment and provides customers with overall technical solutions.
Led by Dr. Gu Haiyang, an expert from the Overseas Talent Recruitment Program, Zhonggui Technology's core team comprises semiconductor equipment and process experts from Silicon Valley, as well as senior technical talents in related fields. It has been successfully selected as a leading innovative and entrepreneurial team in Zhejiang Province. Relying on innovation platforms such as the Zhejiang Provincial Postdoctoral Research Station and the provincial-level high-tech enterprise R&D center, the company has built a comprehensive industry-university-research collaborative innovation system.
The company's main products are chemical mechanical planarization/polishing (CMP) equipment. It has successfully launched several independently developed innovative products covering 6-inch to 12-inch wafers, widely used in key areas such as wafer manufacturing, large silicon wafers, advanced packaging, and silicon carbide substrates. Among them, the 12-inch CMP equipment adopts a novel architecture design with 6 polishing disks and a 2-row parallel layout, breaking through the current mainstream 4- or 3-disk architecture. It can simultaneously support 3-disk or 2-disk processes, meeting various process requirements in advanced manufacturing. This equipment, with its outstanding innovative performance, has been recognized as the first of its kind in China, fully demonstrating Zhongsi Technology's leading technological position and innovation capabilities in the CMP equipment field.
Founded in May 2018, Zhonggui Technology is located in Qingshan Lake Science and Technology City, Hangzhou West Science and Technology Innovation Corridor. It is an innovative enterprise that focuses on the research, development, manufacturing and sales of high-end semiconductor equipment and provides customers with overall technical solutions.
Led by Dr. Gu Haiyang, an expert from the Overseas Talent Recruitment Program, Zhonggui Technology's core team comprises semiconductor equipment and process experts from Silicon Valley, as well as senior technical talents in related fields. It has been successfully selected as a leading innovative and entrepreneurial team in Zhejiang Province. Relying on innovation platforms such as the Zhejiang Provincial Postdoctoral Research Station and the provincial-level high-tech enterprise R&D center, the company has built a comprehensive industry-university-research collaborative innovation system.
The company's main products are chemical mechanical planarization/polishing (CMP) equipment. It has successfully launched several independently developed innovative products covering 6-inch to 12-inch wafers, widely used in key areas such as wafer manufacturing, large silicon wafers, advanced packaging, and silicon carbide substrates. Among them, the 12-inch CMP equipment adopts a novel architecture design with 6 polishing disks and a 2-row parallel layout, breaking through the current mainstream 4- or 3-disk architecture. It can simultaneously support 3-disk or 2-disk processes, meeting various process requirements in advanced manufacturing. This equipment, with its outstanding innovative performance, has been recognized as the first of its kind in China, fully demonstrating Zhongsi Technology's leading technological position and innovation capabilities in the CMP equipment field.
Coreveld Technology, a high-end sensor manufacturer, has secured tens of millions of yuan in Pre-A round financing.
Shanghai Xinrong Technology Co., Ltd. (hereinafter referred to as "Xinrong Technology") announced that it had recently completed a Pre-A round of financing worth tens of millions of yuan. This round of financing was led by Zhejiang Airport Low-Altitude Economy Equity Investment Partnership (Limited Partnership) (hereinafter referred to as "Low-Altitude Fund").
Founded in June 2023 and located in Minhang District, Shanghai, Corerong Technology is dedicated to the research and development of high-end sensors, bridging the gap between existing technologies and user needs at the forefront of sensing technology. The company's founder, Dr. Shang Tonghuo, has many years of experience in the sensor field, having previously worked at Pratt & Whitney, Courier, and Honeywell. Dr. Shang Tonghuo graduated from Beijing University of Aeronautics and Astronautics with a bachelor's degree, and later earned master's and doctoral degrees from MIT, and also pursued an EMBA at Columbia Business School. Corerong Technology boasts a highly experienced technical management team in the sensor industry.
Coretronic Technology independently develops and manufactures sensors covering various categories, including pressure, flow, temperature, rotational speed, position, displacement, and gas. The products are positioned for high-end applications, particularly in strategic industrial sectors such as aerospace, automotive manufacturing, shipbuilding, petrochemicals, engineering machinery, and fluid machinery.
Founded in June 2023 and located in Minhang District, Shanghai, Corerong Technology is dedicated to the research and development of high-end sensors, bridging the gap between existing technologies and user needs at the forefront of sensing technology. The company's founder, Dr. Shang Tonghuo, has many years of experience in the sensor field, having previously worked at Pratt & Whitney, Courier, and Honeywell. Dr. Shang Tonghuo graduated from Beijing University of Aeronautics and Astronautics with a bachelor's degree, and later earned master's and doctoral degrees from MIT, and also pursued an EMBA at Columbia Business School. Corerong Technology boasts a highly experienced technical management team in the sensor industry.
Coretronic Technology independently develops and manufactures sensors covering various categories, including pressure, flow, temperature, rotational speed, position, displacement, and gas. The products are positioned for high-end applications, particularly in strategic industrial sectors such as aerospace, automotive manufacturing, shipbuilding, petrochemicals, engineering machinery, and fluid machinery.
Jinghe Technology completes angel round financing to accelerate the industrialization of heterogeneous integrated equipment.
Suzhou Jinghe Semiconductor Technology Co., Ltd., incubated by the National Third Generation Semiconductor Technology Innovation Center (Suzhou) and Jiangsu Third Generation Semiconductor Research Institute, is a high-tech enterprise focusing on the independent research and development of heterogeneous integration of wide bandgap semiconductor materials and high-end equipment. With the mission of overcoming the international bottleneck technology of "room temperature ultra-high vacuum direct bonding," the company is committed to building a world-leading heterogeneous material integration technology platform and specialized equipment manufacturer.
The University of Electronic Science and Technology and Director of the National Third-Generation Semiconductor Technology Innovation Center (Suzhou) released the achievements of the Third-Generation Semiconductor Equipment Localization R Alliance . Among them, the "Ultra-High Vacuum Room Temperature Direct Bonding Technology and Equipment" developed by the Jinghe Technology team led by Dr. Liang Jianbo was successfully selected. This equipment can achieve atomic-level interface bonding of semiconductor materials such as gallium nitride on 4-inch polycrystalline diamond and has already been promoted and applied in 11 units. To meet the greater market demand, Jinghe Technology is comprehensively advancing the R&D of 12-inch high-end models, targeting high-power RF chips, new energy vehicle electronic control modules, silicon photonic devices and advanced packaging, providing key support for heterogeneous integration technology in the post-Moore's Law era.
he company's core product, the RTDB series of ultra-high vacuum room temperature direct bonding equipment, has successfully covered 2 to 8-inch models. It has overcome the challenges of thermal expansion mismatch, high interfacial thermal resistance, and low yield faced by bonding high thermal conductivity materials such as diamond, GaN, and SiC. Its key performance indicators have reached the international advanced level.
Yuanlei Nano showcases its high-end semiconductor coating equipment at SEMIEXPO Vietnam 2025
Founded in September 2018, Yuanlei Nano was established by a professional team with nearly 20 years of experience in semiconductor equipment and process R&D. It is committed to becoming a high-end semiconductor equipment supplier with core technologies in equipment, materials, processes, and components. The company focuses on the customization, R&D, production, and sales of advanced semiconductor coating equipment. With its leading thin-film equipment design concepts and strong process and material capabilities, it has successively won honors such as High-tech Enterprise, Nanjing Unicorn Enterprise Cultivation, and Jiangsu Province Specialized and Innovative Small and Medium-sized Enterprise. Its entire product line benchmarks against major overseas manufacturers, leading the domestic market.
As an innovator in the semiconductor equipment field, Yuanlei Nano is committed to building a high-end national brand of purely domestically produced semiconductor equipment through independent innovation and vertical integration of the industrial chain. The company's products mainly cover atomic layer deposition (ALD) equipment and silicon-germanium epitaxy (EPI) equipment, which can be widely used in 2.5D/3D advanced packaging, compound semiconductors, and advanced logic memory processes below 28nm, providing high-performance and high-stability equipment solutions to global customers.
Epic CM R
Equipment Introduction: 8/12-inch Low-Temperature Selective Silicon-Germanium Epitaxy Equipment
Application areas: Advanced logic, memory, and power devices below 28 nanometers.
TiNATM Series
Equipment Description: 12-inch multi-chamber atomic layer deposition (ALD) system based on infrared heating
Application areas: Advanced logic, memory, and power devices below 28 nanometers.
Compounds ALD Flura PC-10
Equipment Introduction: 8-inch cluster atomic layer deposition equipment (monthly capacity up to 5000 wafers)
Application areas: Compound semiconductor field
Elegant Ⅱ YE-200/300HL
Equipment type: 8/12-inch atomic layer deposition/atomic layer etching equipment (with in-situ integrated measurement capabilities)
Application areas: Universities, research institutes, etc. that require in-situ testing of atomic layer deposition (e.g., XPS, ellipsometer testing).
