Chinese semiconductor thread II

[gelgoog]

@huemens
I knew it when I saw CXMT at Hefei and YMTC at Wuhan change the design of their Phase II buildings. Instead of one continuous building, they split it in two halves. It was kind of obvious they were going for a segregated prototype line without US equipment.
If they also replaced the non-US Western equipment that is great news for them.

basically, I think Wingsky semi in Shanghai is fully capable of supplying the dies needed by Dongguan facility so Chinese automakers will get the chips they need. Whereas non Chinese automakers are in trouble, including Japanese and American ones. This is blowing up spectacularly on Trump admin.

To do this the question is does WingSkySemi have all the necessary masks or not. Nexchip in the Netherlands probably holds all the designs.

 

[tokenanalyst]

Urepu's 60nm dark field defect inspection equipment was successfully delivered to a leading domestic customer​

Shanghai Unipu Semiconductor Equipment Co., Ltd. announced on its official WeChat on October 23 that the company recently launched a new product series: LSRVision, a dark-field non-patterned wafer defect inspection equipment, and successfully delivered it to a leading domestic customer.

According to reports, the LSRVision series of products are dedicated to wafer surface defect detection, such as Particle, Scratch, Crack, Slipline, Hex Bump, Epi, Shower Head, Crescent, Pit and other defects, and can detect particles up to 60nm in size. By adapting to lasers of different wavelengths, they can be widely used in surface defect detection of silicon carbide substrates and epitaxial wafers, surface defect detection of gallium nitride (GaN) and gallium oxide (Ga2O3) substrates and epitaxial wafers, and surface defect detection of silicon, gallium arsenide (GaAs) and indium phosphide (InP) substrates and epitaxial wafers.



Compared to traditional line scan and photo-based AOI (Auto Optical Inspection) technology, the Uni-Purpose LSR series utilizes a multi-wavelength optical system, a high-speed rotating spindle (>5000 rpm), and multiple photomultiplier tubes with matched filters for signal acquisition. The LSR system can simultaneously collect signals from up to eight channels (scattering, photoluminescence, reflectance, topography, and phase information), ensuring high sensitivity, accurate defect detection, and maximum throughput (WPH).

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[tokenanalyst]

Jingrui Electronics net profit in the third quarter surged 939% year-on-year​

On the evening of October 23rd, Jingrui Electric Materials released its third-quarter earnings report. The company reported operating revenue of 419 million yuan in the third quarter, a year-on-year increase of 14.27%, and net profit of 58.615 million yuan, a year-on-year increase of 938.99%. From the beginning of the year to the end of the reporting period, the company achieved operating revenue of 1.187 billion yuan, a year-on-year increase of 11.92%, and net profit of 128 million yuan,

Explaining the reasons for the net profit increase, Jingrui Electronic Materials stated in its financial report that this was primarily due to increased gross profit margins from its products and price fluctuations in its trading financial assets. After deducting non-recurring gains and losses, the company's net profit for the first three quarters still reached 50.649 million yuan, a year-on-year increase of 528.19%, demonstrating a significant increase in profitability from its core business.

In the third quarter report, Jingrui Electric Materials also disclosed the positive progress of important matters during the reporting period. Its convertible bonds "Jingrui convertible bonds" have matured and been redeemed and delisted; the employee stock ownership plan has been approved; and external guarantees provide support to subsidiaries to ensure their business development.

According to the information, Jingrui Electric Materials' main products include high-purity chemicals, photoresists and supporting materials, functional formula materials, lithium battery materials, pharmaceutical intermediates materials, pre-electronic grade materials and other products, which are widely used in semiconductor, new energy and other industries, and are mainly used in the lithography, development, etching, cleaning, film removal, slurry preparation and other process links of the downstream electronic product production process.

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[tokenanalyst]

Xinlai Materials plans to invest 2 billion yuan to build a semiconductor core components project​

Xinlai Materials announced that its wholly-owned subsidiary Kunshan Fangxin Precision Technology Co., Ltd. (hereinafter referred to as "Fangxin Precision") plans to further increase capital and expand production in Lujia Town, Kunshan City, and invest in the establishment of the Fangxin Precision semiconductor core components project.

On October 23rd, Fangxin Precision signed a "Project Investment Framework Agreement" with the Lujia Town People's Government of Kunshan City. The agreement stipulates that both parties will leverage their respective industrial strengths and resource endowments to establish a long-term cooperation mechanism and engage in multi-channel, multi-field, and multi-level collaboration. The agreement aims to contribute significantly to strengthening, supplementing, and extending Kunshan's semiconductor industry supply chain, promoting mutual benefit and common development. The Lujia Town People's Government of Kunshan City will provide Fangxin Precision with high-quality, one-stop services to ensure the smooth implementation of the project.

The project will primarily focus on the research, development, production, and sales of uniform gas plates and semiconductor aluminum chambers, as well as precision cleaning services for semiconductor, TFT, and OLED equipment. These products are widely used in the semiconductor industry and are a key component of domestic substitution in China's semiconductor industry chain. Upon reaching full production, the project is expected to generate an annual output value exceeding 1.5 billion yuan, with a total investment of 2 billion yuan.

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[tokenanalyst]

SemiDrive Technology's E3650 officially enters mass production, with its 22nm flagship MCU leading the way in next-generation automotive architecture.​

Xinchi Technology, a leader in full-scene intelligent automotive chips, announced that its E3 series MCU flagship product E3650 has officially entered large-scale mass production, completed AEC-Q100 Grade 1 reliability certification, and will accept mass production orders from customers.

As the flagship of the next-generation intelligent control MCU, the mass production of the E3650 not only delivers on its technological promise but also signals that Chinese chip companies are leading and enabling the innovation of automotive electrical and electronic (E/E) architectures. Currently, the E3650 has secured multiple contract projects and has become a core solution for the next-generation vehicle zone controllers (ZCUs) and domain controllers (DCUs).

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[tokenanalyst]

Naura 2nm patent:



According to sources this innovation center is a joint investment between the Beijing development zone and Naura semiconductors to accelerate the development ICs, equipment and materials for the next generation of integrated circuits process nodes.

 

[tokenanalyst]

Multibenzyl Chloride Based Molecular Resists Enabling 13 nm Half-Pitch Lithography via Self-Cross-Linking.​

We developed a negative-tone resist platform based on multibenzyl chloride modified molecular glasses with low molecular weight (<800 Da) to address the resist challenges of electron beam lithography (EBL) and extreme ultraviolet lithography (EUVL). A series of molecular glasses with different substitution positions of the chloromethyl group (designated as AD4xCl, x = O, M, and P, representing the ortho-, meta-, and para-substitution, respectively) were designed and synthesized, and their resists’ lithographic performance was evaluated. The thermal analysis, film-forming capability, and solubility measurements demonstrate the potential of AD4xCl as a negative-tone non-chemically amplified resist (n-CAR) material. Feature sizes as small as 16 nm half-pitch (HP) were achieved using EBL, and a significant effect of the substitution positions on the resolution and sensitivity was observed. Atomic force microscopy (AFM) with peak force quantitative nanomechanical mapping mode measurement confirmed that the difference in substituent positions significantly affects the self-cross-linking efficiency and mechanical strength of the resist films, which is the main reason for the differences in sensitivity and resolution limits. The meta-substituted AD4MCl molecule resist exhibited the best performance and was further investigated by EUVL, achieving an impressive 13 nm pattern with a line edge roughness (LER) of 2.6 nm at an exposure dose of 137.9 mJ cm–2. In situ mass spectrometry and X-ray photoelectron spectroscopy (XPS) showed that the EUV-induced self-cross-linking of multibenzyl radicals among the AD4MCl molecules drives the solubility switch, enabling high-resolution negative-tone patterning.

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[tokenanalyst]

Jiyi Technology's 12-inch IC front-end process surface oxidation/nitriding equipment JETKepler successfully shipped.​

JETKepler, the 12-inch IC front-end process surface oxidation/nitridation equipment independently developed by Jiyi Technology, has been officially delivered to the industry's leading customers. This delivery is of great significance. It is not only an important expansion of Jiyi in the 300mm IC field, but also another successful case of providing large-size surface oxidation/nitridation equipment solutions to industry customers.



JETKepler, a 12-inch IC front-end process surface oxidation/nitridation equipment, is mainly used for wafer etching and high-temperature plasma surface oxidation and nitridation. Isotropic surface treatment: oxidation/nitridation/reduction/improvement of film density/removal of etching residues/reduction of IC Rs. JETKepler features a high-density, low-damage plasma system, excellent temperature uniformity, higher productivity, and lower owning and operating costs.

Jiyi Technology will take this delivery as a new starting point, continue to deepen technology research and development, and continuously optimize product performance. Deepen technological innovation and industrial chain layout, strive to overcome cutting-edge technology bottlenecks, and provide core support for the development of China's semiconductor industry.

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[tokenanalyst]

Interesting, Primarius lithography software as an alternative to Synopsis lithography software.

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[tokenanalyst]

Hejian Software participated in the 2025 BayCore Expo, promoting industry upgrades with its own domestic EDA and high-performance IP.​

Hejian Software focused on showcasing its domestically produced, independently developed digital chip verification full-process solutions, extensive IP solutions, and system-level EDA full-process solutions. It visually demonstrated the superior performance and operating speed of Hejian Software's hardware verification platform, as well as the successful tape-out results of its IP products, attracting many attendees to stop by the booth for in-depth learning.

The nationally produced, self-developed, and fully self-developed digital chip verification full-process solution showcased by Hejian Software covers all scenario requirements, from early virtual architecture design modeling, mid-term hardware simulation acceleration, mid-term subsystem-level software, to late-stage full-chip-level prototype verification . Specific products include:​

• The next-generation, full-featured, high-performance simulator UniVista Simulator Plus (UVS+), the next-generation, full-featured, high-performance digital verification and debugging platform UniVista Debugger Plus (UVD+), and the verification efficiency management system UniVista Verification Productivity System (VPS) : Verification software tools enable digital functional simulation signoff, creating a domestically produced one-stop verification process with a fully self-developed architecture and support for the domestic server ecosystem.​
• UniVista Unified Verification Hardware System (UVHS/UVHS-2) : The newly released UVHS-2 can cascade up to 192 AMD Versal™ Premium VP1902 Adaptive SoCs, providing diverse application scenarios for large-scale ASIC/SOC hardware and software verification. It is widely applicable to the development of various chips, including AI computing, data centers, HPC supercomputing, intelligent driving, 5G communications, smartphones, PCs, and IoT. As a highly efficient hardware and software verification solution, UVHS-2 can significantly shorten chip verification cycles and accelerate chip launches.​
• UniVista Hyperscale Emulator (UVHP), a data center-grade, full-scenario, ultra-large-capacity hardware simulation acceleration and verification platform : The first domestically developed hardware emulator to scale to 46 billion logic gates and support further expansion across multiple systems, significantly improving simulation and verification efficiency and shortening the simulation and verification cycle for ultra-large-scale chips.​
• PHINE DESIGN Advanced Solo Prototyping (PD-AS) : Powered by a single AMD Versal™ Premium VP1902 Adaptive SoC and utilizing advanced technology, the PD-AS more than doubles overall device performance. It also features a flexible and convenient user interface and a rich variety of interface solutions, enabling it to cover a wider range of chip verification scenarios.​
• UniVista V-Builder/vSpace, a virtual prototyping and simulation tool suite , builds a "chip + software + system + application" electronic system and chip design linkage platform. This suite helps users quickly build virtual prototypes of chips or electronic system-level platforms, and run and debug embedded software.​

Hejian Industrial Software's high-speed interface IP solutions support multiple advanced processes, have been tape-out verified, and have been successfully deployed in chips from leading domestic IC companies . They are leading to performance breakthroughs and explosive development of high-computing chips in fields such as intelligent computing, HPC, communications, autonomous driving, and industrial IoT. The extensive IP solutions on display include:
​

• Domestic interface IP solutions : UniVista complete PCIe Gen5 solution, various high-speed interconnect interface controllers such as Ethernet, Flexible Ethernet (FlexE), Interlaken, memory interface HBM3/E, DDR5, LPDDR5 IP, advanced process multi-protocol compatible, integrated transmission interface SerDes IP solution UniVista 32G Multi-Protocol SerDes IP;​
• Intelligent computing networking IP solutions : UniVista RDMA IP, a scale-out application solution; UniVista PAXI IP, a scale-up application solution; and UniVista UEC MAC IP, an Ultra Ethernet IP solution for driving intelligent computing interconnection.​
• Standard IP solutions for advanced chiplet integration : domestic HiPi standard IP/VIP, and UCIe IP, a key international chiplet standard. To overcome computing power limitations, Hejian Software provides two UCIe cross-process interconnection applications: D2D and C2C. This marks the first domestic cross-process node UCIe IP interconnection technology verification.​

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