Chinese semiconductor industry

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ansy1968

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22:14, 17-Apr-2021
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ac3b76ef6ba44fd8859a3a3879323f01.jpeg

File photo of a Loongson chip. /CFP

Loongson Technology, a leading Chinese chip company based in Beijing, unveiled on Thursday its fully self-developed CPU (central processing unit) architecture that uses an original instruction set, which has been hailed as a "historic breakthrough" by industry insiders.

The new infrastructure is named "LoongArch", short for "Loongson Architecture". It has passed the assessment of a leading third-party intellectual property evaluating agency, the company said.

An instruction set architecture (ISA) is the interface between computer hardware and software. It's the underlying architecture that supports the running of an operating system and a whole software ecosystem.

For example, the Windows operating system (OS) runs on U.S. company Intel Corporation's X86 architecture, and the Android mobile OS runs on ARM architecture developed by UK-based chip designer ARM Holdings.

The two best-known ISAs have been dominating on computers and smartphones worldwide since 2010, and both have very large industrial ecosystems including hardware like chips and software such as various applications.

Foreign CPU manufacturers have been using their ISAs as a tool to control the ecosystems and exclude competitors. Other companies have to pay royalties to get the licenses to develop CPUs compatible with them. If Chinese companies rely on those foreign ISAs, it's not possible for them to build an independent industrial ecosystem, according to the company.

"If we compare chip designing to writing articles, an ISA is like the language we use. Chinese people can write an article in English, but can never develop our national culture based on English," Hu Weiwu, chairman and chief scientist of Loongson, was quoted as saying by the Beijing Daily. He's also the chief engineer of the Institute of Computing Technology under the Chinese Academy of Sciences (CAS).

The "LoongArch", which is an outcome of the company's 20 years of hard work and experience in CPU development and ecosystem building, has nearly 2,000 proprietary instructions, the company said.

It's also compatible with other mainstream ISAs, allowing the efficient operation of complicated programs written for other architectures.

So far, Loongson's CPU chip based on the new architecture, named "3A5000", has been taped out and is under internal test. Its processing performance is very close to that of mainstream products on the market, Hu said. A complete OS based on the "LoongArch" has also run stably on computers using the chip.

"Only with our proprietary ISA can we build a new pattern in the information technology industry and form our own industrial chain," Hu told the Science and Technology Daily.

Loongson Technology was jointly funded and set up in 2010 by the Beijing municipal government and the CAS, with the goal of industrializing the technological achievements of the CAS in chip research and development.
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来自 IT之家

【龙芯 3A5000 正式发布:首款采用自主指令系统 LoongArch 的处理器芯片】日前,龙芯中科技术股份有限公司正式发布龙芯 3A5000 处理器。该产品是首款采用自主指令系统 LoongArch 的处理器芯片,性能实现大幅跨越,代表……详情点击:
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IT House
7-23 09:47 From IT House

[Loongson 3A5000 officially released: the first processor chip using own instruction set architecture LoongArch]

Recently, Loongson Technology Co., Ltd. officially released the Loongson 3A5000 processor. This product is the first processor chip that uses Loongson own instruction set architecture LoongArch, and its performance has achieved a significant leap, representing...Click for details: Loongson 3A5000 officially released: the first processor chip that uses the autonomous command system LoongArch


1627013008347.png
 

ericlfh

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来自 IT之家

【龙芯 3A5000 正式发布:首款采用自主指令系统 LoongArch 的处理器芯片】日前,龙芯中科技术股份有限公司正式发布龙芯 3A5000 处理器。该产品是首款采用自主指令系统 LoongArch 的处理器芯片,性能实现大幅跨越,代表……详情点击:
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IT House
7-23 09:47 From IT House

[Loongson 3A5000 officially released: the first processor chip using own instruction set architecture LoongArch]

Recently, Loongson Technology Co., Ltd. officially released the Loongson 3A5000 processor. This product is the first processor chip that uses Loongson own instruction set architecture LoongArch, and its performance has achieved a significant leap, representing...Click for details: Loongson 3A5000 officially released: the first processor chip that uses the autonomous command system LoongArch


1627013008347.png
great! anyone knows if this is available outside of china and where to buy? Would love to support them?
 
D

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YMTC is actually already facing an unofficial Embargo on Production Equipment by the US Govt.
So this has impacted production of its products.
The low yields of the 128 layer Nand is probably caused by using some new local equipment.
The local equipment takes time to mature.
However this yield problem should be solved by 2022 when they are planning to scale production massively of the 128 layer Nand.
2022 is also the time when they will tale delivery of the new SMEE DUVL and alot of other locally made equipment.
This is probably giving nightmares to the competitors of YMTC.
I haven't heard of the soft YMTC embargo (more likely that it's just a backlog) but fwiw, the equipment shipments to China are growing at a very rapid rate
 

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Kaine

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I haven't heard of the soft YMTC embargo (more likely that it's just a backlog) but fwiw, the equipment shipments to China are growing at a very rapid rate
Hi, do you mind giving a source for the data?

And can you say what do the numbers represent?
I am assuming it is the monthly value in ($) dollars. Is that correct?
 
D

Deleted member 15949

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Hi, do you mind giving a source for the data?

And can you say what do the numbers represent?
I am assuming it is the monthly value in ($) dollars. Is that correct?
I'm a trade lawyer in Houston; I don't deal with Chinese IC corporates but I do hear rumors (I won't say more due to atty-client privilege).

Yeah, it's in dollars from usatrade.census.gov. You need to create an account though to get US trade data
 

jfcarli

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I'm a trade lawyer in Houston; I don't deal with Chinese IC corporates but I do hear rumors (I won't say more due to atty-client privilege).

Yeah, it's in dollars from usatrade.census.gov. You need to create an account though to get US trade data
Thanks for posting. Do you know if that is just equipment purchased FROM the US? Fact is that is great news and really makes sense, even if it is just for the US!
 

Kaine

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Registered Member
I'm a trade lawyer in Houston; I don't deal with Chinese IC corporates but I do hear rumors (I won't say more due to atty-client privilege).

Yeah, it's in dollars from usatrade.census.gov. You need to create an account though to get US trade data
Ah ok, i see. Btw thanks for posting this kind of data to the forum.

AFAIR this is the first time I see data on this thread from that source so it is very helpful for understanding the Chinese IC development based on importing IC equipment
 

jfcarli

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Via Vincent seem like the SMEE lithograph machine is being installed in this factory

Qingdao New Core semiconductor packaging production facility started construction on April 2020 and completed on December 2020. 46 pieces of equipment have moved into the facility already and on July 20 SMEE’s lithography machine for semiconductor packaging got delivered to the facility.

Test production starts in October and full production starts in December. The production line is focus on 5G and AI chips.

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来源:爱集微
1天前

集微网消息,7月20日,青岛新核芯高端封测项目首台光刻工艺设备进场仪式在山东青岛西海岸新区举行,标志着该项目建设进入关键性节点,为年底投产奠定了坚实基础。

16268377032602.png


16268377098531.png


据悉,此次进场的设备为SMEE封装光刻机。

青岛西海岸新区国际招商消息显示,目前,该项目厂区已经搬入机台设备46台,预计将于10月份进行试生产,12月份形成量产能力。项目投产后将极大推动新区乃至青岛市集成电路产业转型级升,助力产业链完善,推动经济社会高质量发展。

2020年4月,青岛新核芯高端封测项目通过网上 “云签约”落地新区,将主要运用世界领先封装技术封装目前需求量快速增长的 5G通讯、人工智能等应用芯片。项目实现当年签约、当年落地、当年封顶。

2020年4月15日,青岛半导体高端封测项目通过网上“云签约”,项目落地中日(青岛)地方发展合作示范区,中日(青岛)地方发展合作示范区位于青岛西海岸新区。签约时消息显示,项目总投资10亿元,主要运用世界领先的高端封装技术,封装目前需求量快速增长的5G、人工智能等应用芯片。去年12月22日,青岛半导体高端封测项目主厂房顺利封顶。

由此看来,青岛新核芯高端封测项目或为青岛半导体高端封测项目。

Google translation

Qingdao New Core's high-end packaging and testing project enters the site, and trial production is expected in October​

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2205
Source: Aijiwei

1 day ago
According to the micro-network news, on July 20th, the opening ceremony of the first lithography process equipment of the Qingdao new core high-end packaging and testing project was held in the West Coast New District of Qingdao, Shandong, marking that the project has entered a key node and laid a solid foundation for the end of the year. basis.

It is reported that the equipment entering the field this time is a SMEE package lithography machine.

According to the news of international investment promotion in Qingdao West Coast New Area, 46 machines and equipment have been moved into the plant area of the project. It is expected that trial production will be carried out in October and mass production capacity will be formed in December. After the project is put into production
, it will greatly promote the transformation and upgrading of the integrated circuit industry in the new district and even Qingdao, help improve the industrial chain, and promote high-quality economic and social development.

In April 2020, Qingdao's new core high-end packaging and testing project will land in the new area through online "cloud signing", and will mainly use the world's leading packaging technology to package the current rapidly growing demand for 5G communications, artificial intelligence and other application chips. The project was signed in that year, landed in that year, and capped in that year.

On April 15, 2020, the Qingdao Semiconductor High-end Packaging and Testing Project passed an online "cloud signing", and the project landed in the China-Japan (Qingdao) Local Development Cooperation Demonstration Zone. The China-Japan (Qingdao) Local Development Cooperation Demonstration Zone is located in the West Coast New District of Qingdao. According to news at the time of the contract, the project has a total investment of 1 billion yuan, mainly using the world's leading high-end packaging technology to encapsulate application chips such as 5G and artificial intelligence that are currently in rapid growth in demand. On December 22 last year, the main plant of Qingdao Semiconductor's high-end packaging and testing project was successfully topped off.

From this point of view, Qingdao's new core high-end packaging and testing project may be Qingdao Semiconductor's high-end packaging and testing project. (Proofreading/Xiaobei)
Great news! This litography machine is for packaging. Does anyone know if it is already a 28nm, or older tech?
 
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