Chinese semiconductor industry


Kancil

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Analysis, Insight | July 20, 2021 | The United States Innovation and Competition Act (USICA) of 2021, which passed the Senate in June, calls for $52 billion in appropriations over five years to support semiconductor manufacturing as well...
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This is how the evil Americans are sabotaging Chinese efforts to move up the value chain. So Chinese efforts to wean themselves off US technologies are portrayed as trying to control the semi-cond industry.
 

jfcarli

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Analysis, Insight | July 20, 2021 | The United States Innovation and Competition Act (USICA) of 2021, which passed the Senate in June, calls for $52 billion in appropriations over five years to support semiconductor manufacturing as well...
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This is how the evil Americans are sabotaging Chinese efforts to move up the value chain. So Chinese efforts to wean themselves off US technologies are portrayed as trying to control the semi-cond industry.
The fact is Americans are scared. Almost everything China decides to produce it very quickly displaces most competitors off the market. And mind you, this happens competing in markets which China does not control.

Can you imagine what China can do with a market which it controls nearly 60%.

Problem is a cornered bully can be very dangerous. I don`t think, though, that they will control the semiconductor production very much longer. It is just a matter of a few years.
 

caudaceus

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Analysis, Insight | July 20, 2021 | The United States Innovation and Competition Act (USICA) of 2021, which passed the Senate in June, calls for $52 billion in appropriations over five years to support semiconductor manufacturing as well...
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This is how the evil Americans are sabotaging Chinese efforts to move up the value chain. So Chinese efforts to wean themselves off US technologies are portrayed as trying to control the semi-cond industry.
Did you know that the pottinger guy move to the fdd ?
 

Wangxi

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Global and China Automotive Microcontroller Unit (MCU) Market Report 2021: Chinese Vendors Pursue Replacement of Foreign Peers in the Context of Shortage of Chips"​


Automotive MCU Research: Chinese vendors pursue replacement of foreign peers in the context of "shortage of chips". Concentrated capacity and repeated outbreaks of the COVID-19 make it hard to relieve the shortage of MCUs at once.

MCU, a core chip for vehicle control, finds application in body control, driving control, infotainment and driving assistance. MCU is a mature market featuring a stable pattern. NXP, Infineon, Renesas, STMicroelectronics and Texas Instruments have long been the top five players in the global automotive MCU market where CR7 (hold by international giants) reached over 95% in 2020.

Automotive MCUs with multiple specifications are often produced with 40/45/65nm process, and the operating cost of production lines remains high. So most integrated device manufacturers (IDM) like NXP, Renesas, Infineon, Texas Instruments and Microchip Technology adopt the foundry strategy. Automotive MCU foundry is a highly concentrated industry. Globally, 70% of automotive MCUs are produced by TSMC. Yet MCU capacity makes up a mere 3% of TSMC's total capacity.

As the pandemic in 2020 led to a slump in the demand from automotive industry, MCU vendors reduced their orders and digested their inventory. In 2021, the recovery of global automotive industry has caused a short-term short supply of automotive chips that need a long time to supply.

Since 2021Q2, Malaysia and Taiwan have underwent a much severer COVID-19 outbreak. Taiwan-based TSMC is a major MCU fab; Malaysia is home to OSAT companies of vendors such as NXP, Renesas and Infineon. As a result, automotive MCU industry may be hit hard again, taking a bigger toll on chip supply.

At present, most vehicle and component production suspensions are a result of the shortage of MCUs which are largely demanded by automakers. It is predicted that the lack of chips will last across 2021 but may be eased from 2022 for the following reasons.

(1) Suppliers and fabs race to expand their capacity. For example, Infineon will construct and put into use a new 12-inch fab in late 2021; in 2021, TSMC will produce MCUs 60% more than in 2020, and concentrate on the expansion of its Nanjing plant (28nm) for larger MCU capacity.

(2) Chinese companies are working to make deployments in MCU. They are expected to start mass production in 2022 to replace foreign products and mitigate the short supply of chips. An example is GigaDevice which plans to spawn its latest automotive MCU products in 2021.

In the long run, as vehicles tend to be intelligent, connected and electrified, the shortage of chips will become normal. The basic solution to the supply safety in China's intelligent connected vehicle industry chain is to build an independent chip industry chain.

The short supply of chips will bring the window of opportunity to Chinese MCU industry.

Through the lens of supply chain, MCU ecosystem covers a lot including a variety of software, hardware, development tools, and open source platforms used by end customers. China currently still depends heavily on foreign software and tools.

International manufacturers are in dire need of MCUs amid the short supply of chips. Automakers have begun to add purchase channels and candidate suppliers, which brings the window of opportunity to Chinese MCU vendors.

In China, few companies such as AutoChips, ChipON, Sine Microelectronics, Chipways, BYD and NationalChip can produce MCUs in quantities, among which BYD, Sine Microelectronics, ChipON and AutoChips can support OEMs, but their products are still used for controlling simple functions like windows, lighting and cooling system and rarely seen in power control, intelligent cockpit and ADAS, among other complex applications.

MCU is a platform-based product. With abundant product lines, overseas vendors provide full range of products for customers. At present, Chinese vendors are working to deploying MCU product lines of all series.

Chinese MCU vendors may make breakthroughs in the following two aspects:
Body control: MCU solutions for vehicle wireless charging, ambient light control and flowing water blinker rear light control, which were once available to high-class models, have now been largely used in low- and mid-class vehicles, and the demand will surge.

For example, Sine Microelectronics has rolled out MCUs for vehicle wireless charging and flowing water blinker rear light control, of which ASM87F0812T16CIT, a MCU master chip designed for vehicle LED flowing water blinker rear light has been shipped more than 1.5 million pieces as of January 2021.

Power control: Chinese vendors have begun to introduce related products, but there are still no heavyweight products. Players that have products landed have more potential to replace foreign counterparts.

In May 2021, ChipON launched KF32A156, a new automotive MCU subject to AEC-Q100 standard and using kernel processor. KF32A156 is applicable to power supply, motor control and so on. With wider power domains than the previous products, the mass-produced MCU will be available to 70% body and power control unit modules compared with the previous 30%.

Building an independent industry chain is of vital importance in addition to improving layout of product lines. Coordinating the upstream and downstream resources of the industry chain from IP and chip design to foundry and OSAT helps to make homemade automotive MCUs safer, more stable and more reliable.

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Hendrik_2000

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Via Vincent seem like the SMEE lithograph machine is being installed in this factory

Qingdao New Core semiconductor packaging production facility started construction on April 2020 and completed on December 2020. 46 pieces of equipment have moved into the facility already and on July 20 SMEE’s lithography machine for semiconductor packaging got delivered to the facility.

Test production starts in October and full production starts in December. The production line is focus on 5G and AI chips.

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来源:爱集微
1天前

集微网消息,7月20日,青岛新核芯高端封测项目首台光刻工艺设备进场仪式在山东青岛西海岸新区举行,标志着该项目建设进入关键性节点,为年底投产奠定了坚实基础。

16268377032602.png


16268377098531.png


据悉,此次进场的设备为SMEE封装光刻机。

青岛西海岸新区国际招商消息显示,目前,该项目厂区已经搬入机台设备46台,预计将于10月份进行试生产,12月份形成量产能力。项目投产后将极大推动新区乃至青岛市集成电路产业转型级升,助力产业链完善,推动经济社会高质量发展。

2020年4月,青岛新核芯高端封测项目通过网上 “云签约”落地新区,将主要运用世界领先封装技术封装目前需求量快速增长的 5G通讯、人工智能等应用芯片。项目实现当年签约、当年落地、当年封顶。

2020年4月15日,青岛半导体高端封测项目通过网上“云签约”,项目落地中日(青岛)地方发展合作示范区,中日(青岛)地方发展合作示范区位于青岛西海岸新区。签约时消息显示,项目总投资10亿元,主要运用世界领先的高端封装技术,封装目前需求量快速增长的5G、人工智能等应用芯片。去年12月22日,青岛半导体高端封测项目主厂房顺利封顶。

由此看来,青岛新核芯高端封测项目或为青岛半导体高端封测项目。

Google translation

Qingdao New Core's high-end packaging and testing project enters the site, and trial production is expected in October​

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2205
Source: Aijiwei

1 day ago
According to the micro-network news, on July 20th, the opening ceremony of the first lithography process equipment of the Qingdao new core high-end packaging and testing project was held in the West Coast New District of Qingdao, Shandong, marking that the project has entered a key node and laid a solid foundation for the end of the year. basis.

It is reported that the equipment entering the field this time is a SMEE package lithography machine.

According to the news of international investment promotion in Qingdao West Coast New Area, 46 machines and equipment have been moved into the plant area of the project. It is expected that trial production will be carried out in October and mass production capacity will be formed in December. After the project is put into production
, it will greatly promote the transformation and upgrading of the integrated circuit industry in the new district and even Qingdao, help improve the industrial chain, and promote high-quality economic and social development.

In April 2020, Qingdao's new core high-end packaging and testing project will land in the new area through online "cloud signing", and will mainly use the world's leading packaging technology to package the current rapidly growing demand for 5G communications, artificial intelligence and other application chips. The project was signed in that year, landed in that year, and capped in that year.

On April 15, 2020, the Qingdao Semiconductor High-end Packaging and Testing Project passed an online "cloud signing", and the project landed in the China-Japan (Qingdao) Local Development Cooperation Demonstration Zone. The China-Japan (Qingdao) Local Development Cooperation Demonstration Zone is located in the West Coast New District of Qingdao. According to news at the time of the contract, the project has a total investment of 1 billion yuan, mainly using the world's leading high-end packaging technology to encapsulate application chips such as 5G and artificial intelligence that are currently in rapid growth in demand. On December 22 last year, the main plant of Qingdao Semiconductor's high-end packaging and testing project was successfully topped off.

From this point of view, Qingdao's new core high-end packaging and testing project may be Qingdao Semiconductor's high-end packaging and testing project. (Proofreading/Xiaobei)
 

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