According to Googles AI Bard: "The US government is aware of this issue and is working to address it. The CHIPS and Science Act, which was signed into law in August 2022, provides $52 billion in funding to support semiconductor research, development, manufacturing, and testing in the United States. The act also includes $2 billion to support the development of advanced packaging capabilities in the United States. It is still too early to say whether the CHIPS and Science Act will be successful in reducing US reliance on Taiwan for advanced packaging. However, it is clear that the US government is aware of this issue and is taking steps to address it."
Chinese semiconductor industry
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latest Harmony update now allows it to recognize the virtual core created on Kirin 9000S through hyper threading.
Geekbench score with it are really good, almost as good as Snapdragon 8 Gen 2
I've also seen geekbench scores showing 4800 for 8 Gen 2, but 4206 is higher than anything 8 Gen 1 scores and any Kirin 9000 scores
Hyper threading getting turned on and used at max is bad for power consumption. But at least in terms of peak performance, you are not going to experience any issue with your Mate 60 Pro. It may not be A17, but it should be plenty fast enough with the lighter weight Harmony OS
Geekbench score with it are really good, almost as good as Snapdragon 8 Gen 2
I've also seen geekbench scores showing 4800 for 8 Gen 2, but 4206 is higher than anything 8 Gen 1 scores and any Kirin 9000 scores
Hyper threading getting turned on and used at max is bad for power consumption. But at least in terms of peak performance, you are not going to experience any issue with your Mate 60 Pro. It may not be A17, but it should be plenty fast enough with the lighter weight Harmony OS
Probably only a matter of time, to be fair. It was never really a secret when Tsinghua had publicly available progress announcements on the project the entire time.
Lol, the "lithographic cannon" word they are getting from a random 116 subscriber channel which has 72 views on the video they are linking to.
Bruh, how trashy and tabloidy can ya get?
Also a misunderstanding of LPP as well. The power of the drive laser needs to be well into the dozens of kilowatts with current EUV setups, the final EUV power is in the hundreds of watts range.
I'd be careful with using tools like AI Bard, it can essentially make shit up to fit a narrative.
Perhaps it can be useful to find sources, but quoting it should never be allowed.
Of course. Some people have been tweeting about SSMB non stop in the past week and posting pictures of HEPS and claiming it to be the SSMB-EUV fab.
SSMB is more than a cannon, if current LPP EUV is like the old mercury lamps, SSMB and FELs would be like entering the excimer laser era for EUV.
Yangzhou Guoyu Electronics’ fast-recovery epitaxial diode power chip passed automotive grade certification
"All indicators of the product meet the test requirements and the certification has been passed." Recently, good news came from Yangzhou Guoyu Electronics Co., Ltd., a subsidiary of Guoji Southern, that the fast recovery epitaxial diode power chip developed by the company passed the automotive regulatory standard certification assessment. , marking a new breakthrough in the automotive high-power chip project! Fast recovery epitaxial diode power chips are the "core" of power supply and inverter components. With the development of the new energy automobile industry, high-power chip products with higher voltage, lower power consumption and higher reliability are increasingly favored by the market. "This type of power chip has stricter and higher requirements, difficult research and development, and long verification cycle. Most domestic products of this type need to be imported." The person in charge of Guoyu Electronics said that to keenly capture the market demand, the company adheres to the innovation drive and deeply cultivates epitaxy quickly. R&D and mass production of diode power chip products. At present, it has developed into an enterprise with the most complete product specifications of fast recovery epitaxial diode power chips in China. Apply strength to the difficulties and climb to the peak Walking into the Guoyu Electronics R&D workshop, the staff are busy and determined to move towards the "no man's land" and accelerate the collaborative research on key core technologies. The R&D team has conducted in-depth research and research on the design technology and process technology of automotive-grade fast-recovery epitaxial diode power chips, and is responsible for the Jiangsu Provincial Science and Technology Achievement Transformation Project "Auto-grade high-power fast-recovery epitaxial diode chip R&D and industrialization". As well as Yangzhou City’s key core technology research and catch-up projects, etc.
By pooling their wisdom to tackle key problems, the team has overcome a series of difficulties and achieved completely independent innovation in design, technology and manufacturing. "The fast-recovery epitaxial diode power chip products we developed can work in harsh environments such as high temperature, high humidity, and severe cold when used in the main drive of new energy vehicles." The technician said that the team referred to the automotive electronics reliability test standards to improve the power The test conditions of the chip, continuous optimization of the process, improvement of product yield, and guarantee of product quality will effectively improve the core competitiveness and self-sufficiency rate of domestic automotive fast recovery epitaxial diode power chips, and effectively enhance the security of the industrial chain and supply chain. Over the years, Guoyu Electronics has focused on the R&D and mass production of fast recovery epitaxial diode power chip products, tracking international cutting-edge technologies, and accelerating the transformation of innovation results. Currently, it has successfully developed nearly 200 models of products in four series, and the product quality is in line with automotive standards. Standard or industrial grade requirements, complete specifications.
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