Chinese semiconductor industry

SiC epitaxial equipment company Core III received tens of millions of yuan in financing​

According to the news from Jiwei.com, recently, Xinsandai Semiconductor Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Sinides") received tens of millions of yuan in financing, with Haifu Industrial Investment, Shanghai Huayun and other investors participating in the investment.

Core III was established in 2020. It is committed to the research and development and industrialization of the third-generation semiconductor key equipment-silicon carbide (SiC) epitaxy equipment, and has mastered a number of core technologies in the field of silicon carbide epitaxy.

It is reported that the SiC-CVD equipment developed by the company closely combines technology and equipment through the design of temperature field control, flow field control, etc., in high production capacity, 6/8 inch compatibility, CoO cost, long-term multi-furnace continuous automatic growth There are obvious advantages in terms of control, low defect rate, ease of maintenance and reliability.

ST and Sanan to set up SiC manufacturing jv in China​

"The JV will make SiC devices exclusively for STMicroelectronics, using ST proprietary SiC manufacturing process technology, and serve as a dedicated foundry to ST to support the demand of its Chinese customers."


Just as a general information. ST currently is at the forefront of SiC technology. , instead of the silicon ones, and mainly started this SiC race few years ago.

The fact that they licensed their SiC technology to this JV with Sanan is a big commitment from STM on the future of their presence in Chinese market.

european_guy said:

ST and Sanan to set up SiC manufacturing jv in China​

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"The JV will make SiC devices exclusively for STMicroelectronics, using ST proprietary SiC manufacturing process technology, and serve as a dedicated foundry to ST to support the demand of its Chinese customers."


Just as a general information. ST currently is at the forefront of SiC technology.

Please, Log in or Register to view URLs content!

, instead of the silicon ones, and mainly started this SiC race few years ago.

The fact that they licensed their SiC technology to this JV with Sanan is a big commitment from STM on the future of their presence in Chinese market.

Click to expand...

the bully may "force" the Dutch to cancel it and force to build it in Arizona instead where there is no water nor skilled labour nor market

european_guy said:

ST and Sanan to set up SiC manufacturing jv in China​

Please, Log in or Register to view URLs content!

"The JV will make SiC devices exclusively for STMicroelectronics, using ST proprietary SiC manufacturing process technology, and serve as a dedicated foundry to ST to support the demand of its Chinese customers."


Just as a general information. ST currently is at the forefront of SiC technology.

Please, Log in or Register to view URLs content!

, instead of the silicon ones, and mainly started this SiC race few years ago.

The fact that they licensed their SiC technology to this JV with Sanan is a big commitment from STM on the future of their presence in Chinese market.

Click to expand...

Makes sense. ST doesn't want to loose market share to local competition in the world's largest market. Especially now that Tesla is cutting down its SiC usage.

I saw that Japan aims to triple its semiconductor sales
who is going to buy that? You just pissed off the world's largest user with your reckless sanctions

And the Koreans? They have already seen their semiconductor export drop to China by like what 40%?

If you don't commit to Chinese market, who is going to buy your product?

Beijing Bayi Space-Time LCD Technology Co., Ltd.: the company won a resin order from a domestic photoresist company


On June 6, Beijing Bayi Space-Time LCD Technology Co., Ltd. disclosed the latest research summary, saying that semiconductor photoresist resin, as the core raw material of photoresist, is basically monopolized by foreign countries, and the technical barriers are very high. The difficulty is mainly in the PDI (dispersion) and purity of the resin material. (Gold miscellaneous ppt level). The company has been engaged in the development of electronic grade materials for a long time. It has domestic leading synthesis ability and purification technology, especially the unique ability to analyze and purify the distribution of trace impurities. The company has strong analysis ability and advanced equipment for various organic substances. related R&D advantages. The company focuses on the R&D and mass production of PHS resin, the key raw material of KrF photoresist, and has achieved major breakthroughs.

The R&D team of the company has successfully realized the mass production of 50 kg PHS resin for KrF photoresist, and recently obtained an order for 100 kg grade narrow distribution (PDI<1.2) resin from a core photoresist manufacturer in China, and the material performance index has reached the international advanced level level, can meet the needs of domestic photoresist customers, partially solve the bottleneck problem of domestic photoresist core materials, break the international monopoly, and officially ship to customers.

Polyimide mainly focuses on the research and development of photosensitive polyimide (PSPI). The current formula has been initially finalized and will be verified with customers as soon as possible, and mass production will be gradually realized in the future. It said that the photoresist for photosensitive polyimide panels used in the display panel field has completed the formulation development, and its performance indicators have reached the level of peers; some of the main formulation raw materials have completed self-development. Developed 6 new diamine and dianhydride monomers, and the adhesion between film and copper foil was significantly improved.

Chipshare Technology completes hundreds of millions of yuan in round B financing to strategically deploy overseas markets


Recently, Wuxi Xinxiang Information Technology Co., Ltd. (hereinafter referred to as "Xinxiang Technology"), a domestic semiconductor CIM system service provider, announced that it has completed hundreds of millions of yuan in Series B financing, led by Everest Venture Capital, followed by Xinding Capital and GF Qianhe. Old shareholders continue to invest more.

With the global semiconductor industry and investment and financing at a low ebb, since the completion of hundreds of millions of yuan in the A+ round of financing last year , Xinxiang Technology has received another large amount of financing, and the company's technical capabilities and development potential have been widely recognized.
As a leader in the domestic semiconductor CIM field, ChipShare Technology’s current round of financing will be mainly used to increase R&D investment, talent echelon construction, and the development of new overseas markets , so as to promote China’s semiconductor CIM to the world.
Building the "brain" of semiconductor manufacturing is the time for the rise of CIM
Comparable to the "brain" of semiconductor manufacturing, the CIM system is the key to ensuring the production efficiency and yield control of semiconductor factories. It consists of a variety of industrial software, such as MES, EAP, SPC, etc., and has a high entry threshold. Especially with the upgrade of semiconductor manufacturing process, the role of CIM is becoming more and more important, especially the core MES. It can be said that getting stuck in MES is almost equivalent to choking the "throat" of high-end semiconductor manufacturing.
Over the past few decades, this market has been mainly dominated by foreign companies. In recent years, with the continuous increase of foreign suppression and sanctions, it has become the consensus of the government and industry to promote the localization of semiconductor CIM. With the help of market demand and policies, domestic semiconductor CIM companies are ushering in rare opportunities for development.
Chipshare Technology is a leader in the semiconductor CIM field that has rapidly developed in this trend. At the beginning of its establishment, it aimed at this software "highland" in the semiconductor field. At present, Xinxiang Technology has completely independent intellectual property rights of the semiconductor CIM system, and has formed three major product lines of semiconductor CIM system, intelligent system, and automation equipment. Some mainstream manufacturers can provide a variety of CIM systems.
Shen Congcong, chairman of CoreShare Technology, introduced that CoreShare Technology has achieved localization in the CIM solution for 8/12- inch wafer fabs, and is one of the few domestic companies that can provide overall automation consulting and construction for 8/12-inch wafer manufacturing plants. high-tech enterprises.
In the field of high-end wafer manufacturing, Xinxiang Technology has served nearly 20 12-inch wafer factories in Hefei, Wuhan, Hangzhou, Beijing, Wuxi, Xiamen and other places. At the same time, in the field of packaging and testing, Xinxiang's customers also cover one-third of the top 10 companies in the industry.

Including a top-level talent team, "specialized in all deep" to establish an advantage

The research group of Southern University of Science and Technology won the Best Paper Award at IEEE ISCAS 2023​

From May 21-25, the IEEE International Symposium on Circuits and Systems (ISCAS 2023) was held in the United States. The paper of the Shenzhen-Hong Kong School of Microelectronics, Southern University of Science and Technology was selected and won the third place in the Best Paper Award.

ISCAS 2023 received more than 1,400 paper submissions, and there are 3 best paper awards this time. The research work of the award-winning paper was supported by the National Natural Science Foundation of China, the Guangdong Provincial Basic and Applied Basic Fund, and the Shenzhen Science and Technology Innovation Committee.



Source: Southern University of Science and Technology Shenzhen-Hong Kong School of Microelectronics
For the application scenarios of bidirectional energy transmission including electric vehicles and portable energy storage devices, this paper proposes a fully integrated half-bridge GaN driver chip that can use a single power converter to achieve bidirectional energy transmission. At the same time, the three-level/bipolar gate drive circuit adopted by the chip avoids the problem of wrongly turning on the GaN freewheeling tube in different modes, and improves the reliability of the GaN power supply system. In addition, the fully on-chip integrated bootstrap circuit proposed in this scheme design further reduces the size of the bootstrap capacitor while protecting the gate of the high-side GaN device. The chip has been taped out and tested to achieve high efficiency (93.21%), high power (21.15W) and reliable two-way energy transmission.

tphuang said:

Makes sense. ST doesn't want to loose market share to local competition in the world's largest market. Especially now that Tesla is cutting down its SiC usage.

I saw that Japan aims to triple its semiconductor sales

https://twitter.com/i/web/status/1666081518765371392

who is going to buy that? You just pissed off the world's largest user with your reckless sanctions

And the Koreans? They have already seen their semiconductor export drop to China by like what 40%?

If you don't commit to Chinese market, who is going to buy your product?

Click to expand...

It's very optimistic for you to assume that Rapidus will even get everything up and running in the first place. I personally would be impressed if they actually manage to get a fab set up and running in the first place, let alone be a viable business.

HighGround said:

It's very optimistic for you to assume that Rapidus will even get everything up and running in the first place. I personally would be impressed if they actually manage to get a fab set up and running in the first place, let alone be a viable business.

Click to expand...

Aren't they staffed by industry veterans?
I mean, they will get a fab setup, eventually... maybe after 15 years lmao.

In addition to a new 200mm SiC device manufacturing operation. Sanan Optoelectronics will build and operate separately a new 200mm SiC substrate manufacturing facility.