Chinese semiconductor industry


ansy1968

Brigadier
Registered Member
The big mistake is that Huawei did not jump into lithography sooner. If it had, it would do better job than SMEE now. But, it's really not too late for them still. I think longer term, they will have their own Arfi scanner and lead the effort in EUV. btw, I'm not a Huawei fanboy at all. Just stating what I think is the obvious.
Sir welcome to the club. :) We love Huawei, cause its victory is our victory, our champion and the symbolism it created.
Also, I agree with your point about China being in a rush. SMIC is publicizing their mature node expansion plans, but their Capex investment does not corroborate with that story at all. SMIC Capex is like 7 to 8 times as high as Huahong grace despite capacity expansion being just 50% more (or something like that). So, they are clearly investing in advanced node production. SMIC somehow managed to just pull $1.6 billion out of the thin air to buy more ASML machines. ASML delivery in October just happens to double vs a year ago. All of this are signs to me that Chinese gov't is pushing for more aggressive advanced node production. ASML must have spent good of money to develop 2050i and then 2100i. I doubt they will recuperate their investment without sell at least 10 to 20 of them each. I expect them to fast track these orders while Dutch gov't hold off on implementing new export controls. You don't need 2050i/2100i for 28/22 nm production. These are going toward FinFet production. Yield might not be great, but should be better than if they are using 1980i scanners.
Sir for obvious reason they have a local machine comparable to NXT 1980i, so why import the same;)My speculation when ASML hold the delivery of the already paid EUVL at the behest of the US, they had to compromise with SMIC to smooth out the irritation and may used the paid money to produce a Chinese specific machine. The end results are the NXT 2050i and NXT 2100i.:cool:
 
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Franklin

Captain
its already begun. above discussion about how Chinese firm neglect tools manufacturing in past and didn't coordinate each other.

i have post this many times.

government mobilizing national resources for core technology breakthroughs in key fields like semiconductors tools.

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I think its unfair to blame Chinese industry for past neglect. The issue that people are overlooking is the market condition back in those days. Why would anyone want to invest such big money either private or public in developing these technologies at great cost if sales are uncertain. The semiconductors and the machines to make them coming from outside of China was better, cheaper and they were readily available and there weren't any problems with it back then.

China has in the past four years invested more than 500 billion dollars to get where it is today. Without the bans coming out of America that money and focus simply wasn't there.
 

tokenanalyst

Captain
Registered Member
Well-deserved HuaPro-P1 FPGA prototype verification system HuaPro-P1 was shortlisted for the special exhibition of the 2022 World Computing Conference

Recently, the 2022 World Computing Conference hosted by the Hunan Provincial People's Government and the Ministry of Industry and Information Technology came to a successful conclusion in Changsha, Hunan. As a world-wide industry conference in the field of computing, the conference brings together hundreds of Chinese and foreign academicians, experts, scholars, representatives of entrepreneurs and people from all walks of life from all over the world to build a professional exchange, high-end docking, and win-win sharing for the global computing field. international cooperation platform.

Relying on its excellent system-level software and hardware co-verification capabilities, Xinhuazhang successfully entered the special exhibition of the 2022 World Computing Conference, which focuses on displaying cutting-edge technology products and application innovations in the computing field, with its self-developed FPGA prototype verification system HuaPro-P1. At the event site, HuaPro-P1 benefited from the innovation brought by multiple self-developed patents and its support for domestic computing architecture, and was highly recognized by the participating experts.

The increasing complexity of large-scale integrated circuit design has made chip verification face huge challenges in terms of capital and time. As a high-performance FPGA prototype verification system independently developed by Xinhuazhang, Huajie HuaPro-P1 has obtained 8 national patent authorizations. Based on the self-designed software and hardware collaboration solution, it can help system-level digital customers automate the intelligent design process and effectively reduce the number of users. Manual input, shortening the chip verification cycle, providing a new generation of intelligent pre-silicon verification system with large capacity, high performance, automatic implementation, debuggability and high availability for system verification and software development.

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At present, Xinhuazhang has basically established a complete digital verification full-process service, and related digital verification products have been applied and deployed in actual industrial design projects. Facing the future, Xinhuazhang will continue to focus on cutting-edge technology research and development, and use better products and solutions to help the high-quality development of my country's computing industry.


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tonyget

Junior Member
Registered Member
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The first ASML lithography machine moved in, and Shanghai Construction Engineering helped build China's first 12-inch automotive-grade power semiconductor fab

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The Lingang heavy equipment F16-01 plot undertaken by Shanghai Construction Engineering Group Co., Ltd. recently held a delivery ceremony for Dingtai Jiangxin clean room, and the first ASML lithography machine was moved in.

The project will start in July 2021. After completion, it will become China's first 12-inch automotive-grade power semiconductor automated fab, which is of great significance to the construction of a world-class electric vehicle industry chain in the Lingang New Area. The team of engineers of the Four Construction Group worked together, planned carefully, and advanced efficiently, ensuring the successful realization of the project's goals at each stage, and was highly recognized by the Lingang Industrial Zone and the owner.

https://mianbaoban-assets.oss-cn-shenzhen.aliyuncs.com/xinyu-images/MBXY-CR-3fb4331bd08633154b26dcf77bcafc22.gif


The Lingang Heavy Equipment F16-01 plot project is located in Nanhui New Town, Pudong New Area, east to Xinyuan South Road, west to Hongyin Road, and north to Wanshui Road. The construction includes: FAB production plant (including clean room), OS production scheduling and Large-scale group projects such as R&D building, CB complex building, WH warehouse, CUB power station, etc., have a construction area of 205,000 square meters.

The Dingtai Jiangxin clean room delivered recently is located in the FAB production plant. Shanghai Construction Engineering Fourth Construction Group has successfully achieved the node goal and escorted the smooth move in of lithography equipment.

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As the main factory building for chip production, the FAB plant is the largest single unit in this project, with a construction area of 104,085.98㎡. It has the characteristics of super long, ultra-clean, anti-microseismic, and large roof span.

The FAB production plant is a rectangle of 284.4m×100.8m, which belongs to the super-long concrete structure construction. The super-large and super-long concrete has the characteristics of large volume, complex structural stress, large local load, and high concrete strength. The project divides the foundation floor into 7 major There are 21 small blocks, and the construction is carried out by jumping warehouse method.

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european_guy

Junior Member
Registered Member
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The first ASML lithography machine moved in, and Shanghai Construction Engineering helped build China's first 12-inch automotive-grade power semiconductor fab

View attachment 102434

The Lingang heavy equipment F16-01 plot undertaken by Shanghai Construction Engineering Group Co., Ltd. recently held a delivery ceremony for Dingtai Jiangxin clean room, and the first ASML lithography machine was moved in.

The project will start in July 2021. After completion, it will become China's first 12-inch automotive-grade power semiconductor automated fab, which is of great significance to the construction of a world-class electric vehicle industry chain in the Lingang New Area. The team of engineers of the Four Construction Group worked together, planned carefully, and advanced efficiently, ensuring the successful realization of the project's goals at each stage, and was highly recognized by the Lingang Industrial Zone and the owner.

https://mianbaoban-assets.oss-cn-shenzhen.aliyuncs.com/xinyu-images/MBXY-CR-3fb4331bd08633154b26dcf77bcafc22.gif


The Lingang Heavy Equipment F16-01 plot project is located in Nanhui New Town, Pudong New Area, east to Xinyuan South Road, west to Hongyin Road, and north to Wanshui Road. The construction includes: FAB production plant (including clean room), OS production scheduling and Large-scale group projects such as R&D building, CB complex building, WH warehouse, CUB power station, etc., have a construction area of 205,000 square meters.

The Dingtai Jiangxin clean room delivered recently is located in the FAB production plant. Shanghai Construction Engineering Fourth Construction Group has successfully achieved the node goal and escorted the smooth move in of lithography equipment.

View attachment 102435

As the main factory building for chip production, the FAB plant is the largest single unit in this project, with a construction area of 104,085.98㎡. It has the characteristics of super long, ultra-clean, anti-microseismic, and large roof span.

The FAB production plant is a rectangle of 284.4m×100.8m, which belongs to the super-long concrete structure construction. The super-large and super-long concrete has the characteristics of large volume, complex structural stress, large local load, and high concrete strength. The project divides the foundation floor into 7 major There are 21 small blocks, and the construction is carried out by jumping warehouse method.

View attachment 102436
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They moved in ASML machine even before roof is capped....just to be sure!
 

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