Chinese Radar Developments - KLJ series and others

BoraTas said:

Nope. It is not. If removing the heat from the chips becomes easy, the limitation becomes the overall heat rejection by the system. So the systems which are already limited by it, such as the F-35, would not benefit much. The space is different. Most things aren't cooled well in the space. There is no weight or cost margin for big heat exchangers. Hence the chip itself being more conductive would still make a significant difference.

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yes,

people can think of it this way. In Data centers, the GPUs need various cooling methodology to transfer heat off it first but then will still need liquid to circulate through other areas until it cools down. As such, that's imo why cooling is a much larger issue on something like F-35 than Burke. The former has two main constraints and the latter only has to worry about the radar system itself overheating.

More studies here on GaN-on-Diamond power devices. It shows here that for GaN-on-Diamond, you can get to 40+ W/mm compared to < 20 for GaN-on-Sic on < 5 for GaN-on-Si. It just shows how much more powerful the next generation power devices are going to be.

这是人类历史上最强大的战斗机，你敢跟他的三代元件雷达对视10秒钟嘛

Ayi says J-20A uses 3rd generation IC component for its radar. Very powerful stuff.

tphuang said:

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这是人类历史上最强大的战斗机，你敢跟他的三代元件雷达对视10秒钟嘛

Ayi says J-20A uses 3rd generation IC component for its radar. Very powerful stuff.

Click to expand...

Don’t forget the backend processing too. It is revolutionary. Gap between J-20A and J-20 vanilla is probably bigger than the gap between J-16 and MK2.

tphuang said:

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这是人类历史上最强大的战斗机，你敢跟他的三代元件雷达对视10秒钟嘛

Ayi says J-20A uses 3rd generation IC component for its radar. Very powerful stuff.

Click to expand...

What does that mean?

sequ said:

What does that mean?

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Pretty sure IC is referencing integrated circuits, but no clue about 3rd generation since that’s usually used to refer to computer stuff in the 60s and 70s. Going to take an educated guess and say that the 3rd generation part is either referencing the company that makes them, or more likely its a China specific classification which has different terminology in the Anglosphere.

If I had to guess though, I'm not sure IC is the actual word being used. i want to preface this with the fact I don't speak Chinese and am not an electrical engineer, but I think the sentence might be referring to some form of 3rd generation AESA radar with advanced digital beamforming and architecture. This would be in line with other cutting edge AESA radars which are still in the prototyping stage or just being put on a few aircraft.

sequ said:

What does that mean?

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Actually, in my brother’s university textbook, there is an introduction to third-generation semiconductor materials. These materials are wide-bandgap semiconductors represented by silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), and diamond. They feature characteristics such as large bandgap width, high thermal conductivity, and strong radiation resistance.

there is no need to overthink this. If you want it to be general, then for AESA radar, then the 3 generations so far are:
Gallium Arsenide
GaN on Silicon
GaN on Silicon Carbide

next generation is either GaN on Diamond or GAN on some combo of Diamond & Aluminum Nitride.
and then we get to probably Gallium Oxide on Diamond, which is likely the end for the current type of tech.

tphuang said:

there is no need to overthink this. If you want it to be general, then for AESA radar, then the 3 generations so far are:
Gallium Arsenide
GaN on Silicon
GaN on Silicon Carbide

next generation is either GaN on Diamond or GAN on some combo of Diamond & Aluminum Nitride.
and then we get to probably Gallium Oxide on Diamond, which is likely the end for the current type of tech.

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The "realest" lead China holds in military aviation.

Gen 1: GaA = India, Russia

Gen 2: GaN = US struggling to finalise and get mass production on, some European major players e.g. Leonardo, this material is dated in PLAAF

Gen 3: GaN on Si = mainstay in PLAAF

Gen 4: GaN on SiC = heard about for the last year, fielded on latest PLAAF/PLANAF fighters and probably heavy unmanned platforms.

PLA is literally 2 generations ahead of US in conventional phased array radar tech. Backend processing unknown but likely to be leading too since China basically lapped the world and ahead of the US in those peripheral technology fields.