Chinese Radar Developments - KLJ series and others

tphuang

tphuang

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ACuriousPLAFan said:
I'm certainly not well-versed in radar-related topics, but has this slide been posted before?

According to the slide, (GaN?)-on-Diamond heat-exchange/cooling technology has already been used on large, high-power radar systems and is in overall superior to DARPA's ICECool technology. The photo on the right consisted of the name of Harbin Institute of Technology.

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generally speaking, diamond heat sinks are the best. And China leads the world in heatsink production, so I actually think it's embarrassing that they would compare themselves to DARPA.

Of course among diamond head sinks, there are different designs that are better than others. You also need to factor in cost. I've seen some pretty capable diamond/copper composites that would make sense for RF applications.

I think you could actually have diamond heat sinks without it being the substrate of the IC itself
 
M

MeiouHades

Junior Member
Registered Member
ACuriousPLAFan said:
I'm certainly not well-versed in radar-related topics, but has this slide been posted before?

According to the slide, (GaN?)-on-Diamond heat-exchange/cooling technology has already been used on large, high-power radar systems and is in overall superior to DARPA's ICECool technology. The photo on the right consisted of the name of Harbin Institute of Technology.

View attachment 174860
Click to expand...
China has superior cooling/heatsink tech overall compared to us. To put this into perspective, their vapor chamber cooling designs routinely keep GPU temperatures around 7-10 Celsius below our designs easily. Make of that what you will.
 
L

latenlazy

Brigadier
tphuang said:
generally speaking, diamond heat sinks are the best. And China leads the world in heatsink production, so I actually think it's embarrassing that they would compare themselves to DARPA.

Of course among diamond head sinks, there are different designs that are better than others. You also need to factor in cost. I've seen some pretty capable diamond/copper composites that would make sense for RF applications.

I think you could actually have diamond heat sinks without it being the substrate of the IC itself
Click to expand...
On substrate solutions should have significant advantages in heat transfer rates and that should help a lot with total local cooling capacity. Ultimately what matters is moving the heat away from the components that are heat sensitive to areas of the system that aren’t, and the faster you can do that the more effective cooling you’ll achieve on the critical components you care most about.
 
TheWanderWit

TheWanderWit

Junior Member
Registered Member
ACuriousPLAFan said:
I'm certainly not well-versed in radar-related topics, but has this slide been posted before?

According to the slide, (GaN?)-on-Diamond heat-exchange/cooling technology has already been used on large, high-power radar systems and is in overall superior to DARPA's ICECool technology. The photo on the right consisted of the name of Harbin Institute of Technology.

View attachment 174860
Click to expand...
Looking back at this, aren't these just test articles of GaN-on-Diamond technology being implemented onto various "test" radar systems by HIT? From what I know, isn't the consensus that GaN-on-Diamond and Ga2O3 applications are still immature and not there just yet for such operational implementations to military radar platforms?
 
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