Its a good wake up call, better it be this than rather the first time of a wake up call being a nuke over their city or US troops on their streets etc... Too many Chinese still have no idea that America means to totally destroy China completely.
News on China's scientific and technological development.
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Its a good wake up call, better it be this than rather the first time of a wake up call being a nuke over their city or US troops on their streets etc... Too many Chinese still have no idea that America means to totally destroy China completely.
Well given that the USA has never faced a foe with the means to fight back and now the will, the USA better be prepared for a fight they have never faced before. They have had it easy before, but now they are not going to get away that easy. Especially when there economy is in the dumps and the pandemic is far from over and they are more divided then ever. This time, they have a good chance of finally paying the price.
Also, I am looking into the next Huawei or Samsung or anything not apple given the situation. Really, I can’t imagine apple is going to be very happy about this situation unfolding because of Trump/Pompeo
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No more iPhones for me either. The risk is too high.
I'm already planning on helping family transition to Android and will sell the iPhones eventually.
from cnTechPost
Huawei Intelligent Vehicle BU CTO explains its digital system architecture
2020-08-14 23:18:47 GMT+8 | cnTechPost
0
At the 2020 China Automotive Forum held on August 13 - 15, Huawei Intelligent Vehicle BU CTO Cai Jianyong gave a detailed answer on Huawei VehicleStack digital system architecture in his presentation.
Cai Jianyong believes that in 5-10 years, intelligent driving will be the focus of competition, and the intelligent cabin will become the focus of differentiation for manufacturers.
He believes that the shape of the car and the usage scenarios of the car will change dramatically, and the experience inside the car will become very rich and very diverse. Therefore, all of Huawei's smart car solutions have taken into account possible future needs.
Huawei is building a digital system through CCA+VehicleStack, which looks at traditional vehicles from six perspectives: mechanical, high-voltage battery and electrical, low-voltage component, software, application and cloud service.
Cai Jianyong said the system architecture should be designed so that the software is scalable and can be reused and the hardware scalable and replaceable across models, software, and even across OEMs. Ideally, the sensors should be plug-and-play.
Cai Jianyong gave an initial analysis of the architecture's value, dividing it into four dimensions: cost optimization (saving 15-20 percent in harness weight and length, reducing the number of ECUs and assembly costs), time-to-market (verifying that all models are available at once, saving development time on a large scale), enabling continuous evolution of automated driving from L0 to L4 architectures, and a unified architecture that facilitates the development of new applications across different functional domains.
On May 27, Ren Zhengfei, founder of Huawei, issued a document on organizational changes in Huawei, approving the establishment of the Intelligent Vehicle Solutions BU, which is under the management of the ICT Management Committee.
Huawei Intelligent Vehicle BU CTO explains its digital system architecture
2020-08-14 23:18:47 GMT+8 | cnTechPost
0
At the 2020 China Automotive Forum held on August 13 - 15, Huawei Intelligent Vehicle BU CTO Cai Jianyong gave a detailed answer on Huawei VehicleStack digital system architecture in his presentation.
Cai Jianyong believes that in 5-10 years, intelligent driving will be the focus of competition, and the intelligent cabin will become the focus of differentiation for manufacturers.
He believes that the shape of the car and the usage scenarios of the car will change dramatically, and the experience inside the car will become very rich and very diverse. Therefore, all of Huawei's smart car solutions have taken into account possible future needs.
Huawei is building a digital system through CCA+VehicleStack, which looks at traditional vehicles from six perspectives: mechanical, high-voltage battery and electrical, low-voltage component, software, application and cloud service.
Cai Jianyong said the system architecture should be designed so that the software is scalable and can be reused and the hardware scalable and replaceable across models, software, and even across OEMs. Ideally, the sensors should be plug-and-play.
Cai Jianyong gave an initial analysis of the architecture's value, dividing it into four dimensions: cost optimization (saving 15-20 percent in harness weight and length, reducing the number of ECUs and assembly costs), time-to-market (verifying that all models are available at once, saving development time on a large scale), enabling continuous evolution of automated driving from L0 to L4 architectures, and a unified architecture that facilitates the development of new applications across different functional domains.
On May 27, Ren Zhengfei, founder of Huawei, issued a document on organizational changes in Huawei, approving the establishment of the Intelligent Vehicle Solutions BU, which is under the management of the ICT Management Committee.
The broader principle here is consistent... software trumps hardware.
Another piece of evidence for why China needs to invest in its software stack. The problem with the Japanese, Koreans, and Taiwanese is that although they are great at hardware they have virtually no presence in software.
Wait what? weren't you saying EUV is ten times harder than nuclear fusion a while back?
SMEE will have to partner with SMIC, Yangtze Memory, Huawei, Xiaomi, Tsinghua Unigroup, the Changchun Institute of Optometrics, the Chinese Academy of Sciences and multiple others, especially ones located domestically. For fear of probable eventual US sanctions because it is a Chinese entity at the very forefront of commercially developing the type of technology which the United States absolutely does not China to possess , foreign entities will likely fear associating with to any substantial extent.
Great progress had been achieved from the flash memory front.
from cnTechPost
Yangtze Memory's 128-layer QLC flash memory debuts with highest I/O speed
2020-08-14 23:48:14 GMT+8 | cnTechPost
0
After announcing the successful development of 128-layer QLC 3D flash memory on April 13 this year, Yangtze Memory Technologies, China's top memory chipmaker under the umbrella of Tsinghua Unigroup, publicly demonstrated its 128-layer QLC 3D NAND flash memory chip at the China Electronic Information Expo held today.
Yangtze Memory showcased a 64-layer, a 128-layer stack of flash memory this time, of which the former is the first 64-layer flash memory developed and mass-produced by a Chinese company. It is based on the Xtacking stacking architecture, and the storage density per unit area is the largest in its class.
At present, the main product of Yangtze Memory's mass production is 64-layer TLC flash memory, which has been adopted by a large number of manufacturers' SSD hard drives.
The 128-layer QLC flash memory shown by Yangtze Memory is the next generation product after 64-layer flash memory, based on the Xtacking 2.0 architecture.
According to the company, the uniqueness of this product is that it is the industry's first 128-layer QLC 3D NAND. It has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among known models.
In terms of performance, Yangtze Memory revealed that the two products have 1.6Gbps I/O read and write performance, and the single 3D QLC capacity is as high as 1.33Tb, which is 5.33 times that of the previous generation of 64 layers.
from cnTechPost
Yangtze Memory's 128-layer QLC flash memory debuts with highest I/O speed
2020-08-14 23:48:14 GMT+8 | cnTechPost
0
After announcing the successful development of 128-layer QLC 3D flash memory on April 13 this year, Yangtze Memory Technologies, China's top memory chipmaker under the umbrella of Tsinghua Unigroup, publicly demonstrated its 128-layer QLC 3D NAND flash memory chip at the China Electronic Information Expo held today.
Yangtze Memory showcased a 64-layer, a 128-layer stack of flash memory this time, of which the former is the first 64-layer flash memory developed and mass-produced by a Chinese company. It is based on the Xtacking stacking architecture, and the storage density per unit area is the largest in its class.
At present, the main product of Yangtze Memory's mass production is 64-layer TLC flash memory, which has been adopted by a large number of manufacturers' SSD hard drives.
The 128-layer QLC flash memory shown by Yangtze Memory is the next generation product after 64-layer flash memory, based on the Xtacking 2.0 architecture.
According to the company, the uniqueness of this product is that it is the industry's first 128-layer QLC 3D NAND. It has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among known models.
In terms of performance, Yangtze Memory revealed that the two products have 1.6Gbps I/O read and write performance, and the single 3D QLC capacity is as high as 1.33Tb, which is 5.33 times that of the previous generation of 64 layers.
AssassinsMace
Lieutenant General
I guess you forget or don't even know Chinese teams regularly win programming competitions.