Chinese semiconductor thread II

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Proteus

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Michael90 said:
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Taiwanese companies are known for their ruthless labour abuses and exploitation of their workers . It’s well documented , even their factories in China were well known for their slave like labour abuses .
the fact that even the workers in a poor country like India said they had enough, shows just how much ruthless they are.
Well, at least India has some labour laws/unions to protect workers somehow . At least on papers .
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Well, Fujian 老板 is quite the same lol, they have a bad reputation in South East Asia.
 
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jx191

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sunnymaxi said:
this is the official statement from the company as they are preparing for the largest ever IPO in coming month. most likely over a Trillion RMB. they are expecting further growth in second quarter and first half revenue will exceed 16-17 Billion dollars (110+ Billion RMB).

CXMT become the first Chinese semiconductor company to enter in 100 Billion RMB revenue club and will also become the first company to open 200 Billion RMB club.
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When can we expect CXMT to be producing HBM3 at reasonable scale?

There are conflicting reports, some say they have already started HBM3 production but other reports say production of HBM3 is not likely in 2026.
 
sunnymaxi

sunnymaxi

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jx191 said:
When can we expect CXMT to be producing HBM3 at reasonable scale?

There are conflicting reports, some say they have already started HBM3 production but other reports say production of HBM3 is not likely in 2026.
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HBM3 successfully tested in Q3, 2025 by Huawei and CXMT was planning to mass produce in 2026 and as per the Korean Media they will allocate 60,000 wpm capacity only to HBM.

now what is the current update regarding HBM3 mass production ? no concrete info but as CXMT planning for IPO i believe HBM related news will disclose soon.
 
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jx191

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sunnymaxi said:
HBM3 successfully tested in Q3, 2025 by Huawei and CXMT was planning to mass produce in 2026 and as per the Korean Media they will allocate 60,000 wpm capacity only to HBM.

now what is the current update regarding HBM3 mass production ? no concrete info but as CXMT planning for IPO i believe HBM related news will disclose soon.
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Recent Korean media reports say that HBM3 production at scale is not likely in 2026 anymore and will have to wait until 2027 which is disappointing.

I wonder how this will affect Huawei's planned Atlas 950 rollout for AI compute. I was optimistic that the Atlas 950 at scale would be a huge win for domestic compute but I wonder what will happen now with CXMT's HBM3 delays.
 
sunnymaxi

sunnymaxi

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jx191 said:
Recent Korean media reports say that HBM3 production at scale is not likely in 2026 anymore and will have to wait until 2027 which is disappointing.

I wonder how this will affect Huawei's planned Atlas 950 rollout for AI compute. I was optimistic that the Atlas 950 at scale would be a huge win for domestic compute but I wonder what will happen now with CXMT's HBM3 delays.
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from April month.. this is Korean Media

1. CXMT (DRAM 및 HBM)
• 2024: ~100,000 WPM level
• 2025: ~200,000 WPM
• 2026: ~300,000 WPM target = Top 3 global rankings
• 2027: 350,000-400,000 WPM
A structure that quickly approaches the level of Samsung (500,000) and Hynix (400,000)
CXMT aims to improve constitution and economies of scale at the same time, with high value-added lines centered on DDR5 and HBM (High Bandwidth Memory) rather than traditional DDR4.
• Shanghai New Fab Construction: It is building a production facility in Shanghai that is two to three times larger than Hefei's headquarters, with the goal of operating it in 2027. Equipment imports will begin in the second half of 2026.
· Target to Expand Production Capacity: We have already expanded our DRAM production capacity from 105,000 units per month at the end of 2023 to 250,000 to 270,000 units per month. With the expansion of the Shanghai plant, our production capacity is expected to double or triple its current capacity.
• Securing HBM Exclusive Line: By 2026, we plan to allocate approximately **20%** of total production capacity to mass production of HBM3 modules. Target wafer input is known to be around 60,000 units per month.
• Hefei Phase 2 Expansion: It will secure 40,000 additional production capacity per month through the Phase 2 expansion of its existing Hefei plant, bringing its total production to over 300,000 units per month.
• Technology Node: To avoid regulation, we are continuing to introduce equipment, naming the 17nm process 18.5nm class, and we are rapidly transitioning our lines to high-performance products such as DDR5-8000 and LPDDR5X.
 
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jli88

Junior Member
Registered Member
sunnymaxi said:
from April month.. this is Korean Media

1. CXMT (DRAM 및 HBM)
• 2024: ~100,000 WPM level
• 2025: ~200,000 WPM
• 2026: ~300,000 WPM target = Top 3 global rankings
• 2027: 350,000-400,000 WPM
A structure that quickly approaches the level of Samsung (500,000) and Hynix (400,000)
CXMT aims to improve constitution and economies of scale at the same time, with high value-added lines centered on DDR5 and HBM (High Bandwidth Memory) rather than traditional DDR4.
• Shanghai New Fab Construction: It is building a production facility in Shanghai that is two to three times larger than Hefei's headquarters, with the goal of operating it in 2027. Equipment imports will begin in the second half of 2026.
· Target to Expand Production Capacity: We have already expanded our DRAM production capacity from 105,000 units per month at the end of 2023 to 250,000 to 270,000 units per month. With the expansion of the Shanghai plant, our production capacity is expected to double or triple its current capacity.
• Securing HBM Exclusive Line: By 2026, we plan to allocate approximately **20%** of total production capacity to mass production of HBM3 modules. Target wafer input is known to be around 60,000 units per month.
• Hefei Phase 2 Expansion: It will secure 40,000 additional production capacity per month through the Phase 2 expansion of its existing Hefei plant, bringing its total production to over 300,000 units per month.
• Technology Node: To avoid regulation, we are continuing to introduce equipment, naming the 17nm process 18.5nm class, and we are rapidly transitioning our lines to high-performance products such as DDR5-8000 and LPDDR5X.
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How is CXMT planning to deal with the unavailability of EUV? It has stretched DUV quite far, but wouldn't that be a bottleneck soon enough?
 
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