Chinese semiconductor thread II

Michael90

Junior Member
Registered Member
But then the american sanction hit it and almost decimated it (layoffs and stopping factory expansion etc, early 2023 and I think even the CEO had to step down due to having american Green Card).
Wow...never knew that. Why did he step down just because he had American green card? I know the US forbid any American citizen or green card holder from working in any Chinese tech company sanctioned/blacklisted by the U.S . However, I still think he could have carried on working for the company. The worse that could happen is losing his green card. Unless he couldn't risk losing that just for the company.
 

gelgoog

Lieutenant General
Registered Member
I am well aware of (almost) all the answers from above. I just want to know that, YMTC will be able to achieve 300+L in the near future. I remember vividly, when YMTC released 232L, the Leading players were still at 100 something Layers and were thinking of introducing 200+ layers after some quarters of YMTC 232L release! How cool is that from YMTC, coming out of nowhere and being at the bleeding edge.
Those 232L were in a single deck. Although YMTC did use bonding where the logic was in one wafer, and the memory cells in another wafer.

But then the american sanction hit it and almost decimated it (layoffs and stopping factory expansion etc, early 2023 and I think even the CEO had to step down due to having american Green Card).
I think it was more like the YMTC company board moved him to a different position where he was not involved in day to day managing which would infringe sanctions.

Seeing YMTC introduce 294L (272 Active Layers actually) gives me immense joy but want them to be in their prime of 2022. Where they are better then the Industry "leaders". I hear SKHynix is about to introduce 320+Layer NAND in this Quarter. So, YMTC has some catchup to do
SK Hynix are the ones behind. "is about to introduce" does not mean it is available yet.
 

Wahid145

Junior Member
Registered Member
Those 232L were in a single deck. Although YMTC did use bonding where the logic was in one wafer, and the memory cells in another wafer
That's exactly my point. Imagine if they can get back to single deck 232L (maybe even 250L by now) and then use hybrid bonding on that! 232+232L = 464L. Obviously much higher then 294L.

I'm in no way discrediting their current achievement. It's just incredible! But their potential is even more incredible once AMEC and Naura head on competes on LAM and even out inovates LAM
 

tokenanalyst

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China Science and Technology Flying Test's "Detection System" Patent Announced​



Tianyancha shows that the "detection system" patent of Shenzhen Zhongke Feice Technology Co., Ltd. has been announced. The application publication date is December 13, 2024, and the application publication number is CN119125168A.
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The embodiment of the present application discloses a detection system for eliminating the influence of pump light noise and accurately detecting samples. The method of the embodiment of the present application includes: a light source component for emitting detection light and pump light; a first light splitting component for receiving the pump light and dividing the pump light into a pump signal light and a pump reference light, the pump signal light being used to induce changes in the optical properties of the sample; a signal processing module for receiving the pump reference light and the detection signal light formed by the detection light incident on the sample, the signal processing module including a first noise removal component, the first noise removal component being used to remove the pump light noise in the detection signal light according to the pump noise frequency domain of the pump reference light; the signal processing module is also used to determine the detection result of the sample according to the detection signal light after the pump light noise is removed.

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tokenanalyst

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Shenzhen Huanbo Technology Co., Ltd. completed Pre-A round of financing of over 100 million yuan, injecting new impetus into the innovation and development of high-end electronic ceramics​


In the wave of technological innovation, Huanbo has attracted the attention of many investors with its leading technical strength and broad market prospects. Recently, Shenzhen Huanbo Technology Co., Ltd. (hereinafter referred to as "Huanbo Technology") officially announced the completion of Pre-A round of financing of over 100 million yuan. This round of financing was jointly invested by well-known mother funds Shenzhen Angel Mother Fund Direct Investment Fund, Zhongying Venture Capital, Share Investment and Dalaimisi and many other well-known industry figures. The funds raised this time will be mainly used to promote the large-scale production and market expansion of domestic high-end precision RF ceramic substrates and large-size special ceramic substrates, which indicates that Huanbo Technology has once again made significant progress in the journey of using materials science and technological innovation to lead industrial progress and social development.

Under the guidance of the technical research and development team led by two academicians, Huanbo Technology has stood out in the high-end precision electronic ceramics industry and has become a leading enterprise that masters the core technology of advanced electronic ceramic materials. Its main products include advanced ceramic wafers, advanced ceramic substrates, and ceramic packaging tubes and shells, which are widely used in aerospace, automotive electronics, RF communication modules, optical communication modules, integrated circuit packaging, chip packaging and other fields.

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tokenanalyst

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New patent of AMEC: Innovative etching technology to improve semiconductor production efficiency​


In the semiconductor manufacturing industry, etching technology is a vital link in the process chain. As the market demand for high-performance electronic devices continues to increase, improving etching efficiency is particularly important. Recently, China Micro Semiconductor Equipment (Shanghai) Co., Ltd. applied for a patent called "Etching Method and Plasma Etching Device" (publication number CN119340235A). This technology is expected to bring revolutionary changes to the semiconductor industry.

According to the abstract of the patent, the etching method and apparatus improve the processing efficiency of the substrate through a novel alternating heating and etching steps. Specifically, the method first etches below 0°C, then heats the substrate to above 60°C, and discharges the byproducts deposited on the substrate surface in gaseous form. This technological innovation can not only effectively remove the byproducts generated during the etching process, but also greatly increase the speed of the etching process through the resulting temperature change.

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tokenanalyst

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TuoJing Technology and others established a new company​


Recently, Tuojing Technology (Qingdao) Co., Ltd. was established, with Liu Jing as the legal representative, and a registered capital of 50 million yuan. Its business scope includes: manufacturing of electronic special equipment; sales of electronic special equipment; manufacturing of semiconductor device special equipment; sales of semiconductor device special equipment, etc. According to the equity penetration of Qichacha, the company is jointly held by Tuojing Technology and others.

On the evening of January 20, Tuojing Technology disclosed its 2024 annual performance forecast, and it is expected that the company will achieve annual operating income of 4 billion to 4.2 billion yuan in 2024, an increase of 1.295 billion to 1.495 billion yuan compared with the same period last year, a year-on-year increase of 47.88% to 55.27%. According to the information, Tuojing Technology focuses on the research and development and production of high-end semiconductor special equipment. Its product lines include three series: plasma enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment, and sub-atmospheric pressure chemical vapor deposition (SACVD) equipment. The products have been widely used in the production lines of domestic mainstream wafer fabs such as SMIC, Huahong Group, Yangtze Memory, Changxin Memory, Xiamen Unigroup, and Yandong Microelectronics.

In the first half of this year, new products and new processes such as Tuojing Technology's ultra-high aspect ratio trench filling CVD equipment, PE-ALD SiN process equipment, HDPCVD FSG, and HDPCVD STI process equipment have been verified and introduced by downstream users. At the end of December last year, Tuojing Technology issued an announcement that the company's holding subsidiary Tuojing Jianke (Haining) Semiconductor Equipment Co., Ltd. (hereinafter referred to as "Tuojing Jianke") intends to sign an equipment purchase contract with Shanghai Jiyi Technology Co., Ltd. (hereinafter referred to as "Jiyi Technology"), with a total contract amount of approximately RMB 10 million (including tax). This time, it plans to purchase a silicon carbide etching equipment. This equipment purchase will help improve Tuojing Jianke's production capacity and provide guarantees for the industrialization of new products.

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tokenanalyst

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Montage Technology Launches Domestic PCIe 6.x/CXL 3.x Retimer​

Montage Technology announced the launch of its latest developed PCIe 6.x/CXL 3.x Retimer chip, and has successfully sent samples to customers. It is currently developing the PCIe 7.0 Retimer chip.
Lanqi Technology said that for typical application scenarios such as general-purpose and AI servers, active cables (AEC) and storage systems, the company can provide a full set of technical support services including reference design solutions, evaluation boards and supporting software based on the chip.
The product complies with PCIe 6.x and CXL 3.x technical specifications, adopts the industry's mainstream packaging, and has made smooth progress in interoperability testing with CPUs, test equipment, and terminal devices.
Official data shows that Montage Technology's PCIe 6.x/CXL 3.x Retimer chip supports 16 channels, and its maximum data transmission rate can reach 64GT/s, which is twice as high as PCIe 5.0.
It is reported that the chip uses the PAM4 SerDes (IT Home Note: high-speed serial interface) IP independently developed by Montage Technology, which supports low transmission latency and a link budget of up to 43dB.
Lanqi Technology said that through the innovative DSP architecture, the chip can effectively address design challenges such as crosstalk and reflections commonly found in PCIe 6.x systems, while supporting enhanced link training features and telemetry functions to achieve more comprehensive link monitoring and fault diagnosis.

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tonyget

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DeepSeek Reportedly Reveals Huawei’s Ascend 910C Reaches 60% of NVIDIA H100’s Inference Power​


While DeepSeek’s efficient AI model has fueled debate on NVIDIA’s dominance, China’s Huawei also puts pressure on the U.S. chip giant with its Ascend 910C, a variant of the 2019 Ascend 910 AI chip. According to the reports from Wccftech and Tom’s Hardware, citing Chinese media outlet AGI Hunt(知识星球), Ascend 910C achieves 60% of NVIDIA H100’s performance, delivering strong inference results.

Interestingly enough, the breakthrough was released by DeepSeek’s researchers after they tested Huawei’s chips, the reports add. Anyhow, the information demonstrates China’s AI progress under U.S. restrictions, as the country gradually reduces its reliance on NVIDIA’s GPUs.

The reports suggest that Huawei’s Ascend 910C is a fully in-house chip built on SMIC’s 7nm N+2 process, featuring 53 billion transistors. Like its predecessor, the Ascend 910, it uses chiplet packaging, but while the original was made by TSMC on N7+, the 910C’s compute chiplet is produced by SMIC.

On the other hand, the Tom’s Hardware report also points out that Huawei’s Ascend 910C is not the best choice for AI training, where NVIDIA remains the leader of the domain.

Citing DeepSeek’s Yuchen Jin, the AGI Hunt report also notes that Chinese chips still struggle with long-term training reliability due to NVIDIA’s deeply integrated ecosystem, CUDA, which has been built over two decades. While inference can be optimized, Huawei still needs to improve its hardware and software for sustained training workloads, the report adds.

Meanwhile, this is not the only challenge NVIDIA has to tackle recently. According to Bloomberg, the White House and the FBI have launched an investigation into whether China’s AI startup DeepSeek illegally obtained NVIDIA chips through third-party buyers in Singapore and other locations.

Furthermore, US President Donald Trump remains firm on tariffs, despite meeting with NVIDIA CEO Jensen Huang. Speaking to the press on Friday last week, he confirmed plans to impose tariffs on chips, oil, and gas, likely by February 18, as noted by The Register.
 
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