Chinese semiconductor industry

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Tyler

Captain
Registered Member
WTAN said:
Good Video!

Gigaphoton has a good LPP which generates about 250W.

According to a person who works at SMEE, CAS has not yet decided on which Light Source to use in the EUVL.
This means that they are studying different types of Light Sources, LPP or DPP etc.

I would not be surprised if China goes ahead and purchases this Light Source from Gigaphoton for evaluation. They will probably use this Light Source to produce a Prototype EUVL as this will speed up the general development of EUVL in China. Even better if they can get the technology transfer for it.
At the same time the CAS will continue parallel development of its own Light Sources. This is a common dual track strategy in China.

Of course whether Japan is able to sell this depends on getting approval from its "Master" the USA.
Click to expand...
Japan can just sell it to SMEE and CAS. The Chinese will pay in rmb.
 
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Wangxi

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Two more China chip projects go belly up

Following default on a $198 million debt repayment, Tsinghua Unigroup has put the construction of a NAND fab and a DRAM fab on hold, reports the Nikkei.
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The NAND fab was to have been an $30 billion, 100k wpm facility in Chengdu. No orders for equipment have been placed and the project is on hold.

The DRAM fab was to have been built in Chongqing with a budget reported to be of $110 billion. It planned to have first silicon in 2022. It has now been halted.

“The DRAM project is currently facing delays as there are not enough talent and sources of reliable technology to move ahead that quickly,” a source told the Nikkei.

China’s planning authority – the National Development and Reform Commission – has told local governments that they won’t be bailed out if their chip investments go bust.

The Tsinghua projects follow the road to oblivion of three fab-building projects: Fujian Jin Hua, Wuhan Hongxin Semiconductor Manufacturing Co and the GloFo-Chengdu foundry jv initiative.

Of China’s big fab initiatives, only two remain in play: Yangtze Memory for NAND and ChangXin Memory For DRAM.

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ansy1968

Brigadier
Registered Member
Wangxi said:
Two more China chip projects go belly up

Following default on a $198 million debt repayment, Tsinghua Unigroup has put the construction of a NAND fab and a DRAM fab on hold, reports the Nikkei.
Please, Log in or Register to view URLs content!


The NAND fab was to have been an $30 billion, 100k wpm facility in Chengdu. No orders for equipment have been placed and the project is on hold.

The DRAM fab was to have been built in Chongqing with a budget reported to be of $110 billion. It planned to have first silicon in 2022. It has now been halted.

“The DRAM project is currently facing delays as there are not enough talent and sources of reliable technology to move ahead that quickly,” a source told the Nikkei.

the China's planning authority – National Development and Reform Commission – has told local governments that they won’t be bailed out if their chip investments go bust.

The Tsinghua projects follow the road to oblivion of three fab-building projects: Fujian Jin Hua, Wuhan Hongxin Semiconductor Manufacturing Co and the GloFo-Chengdu foundry jv initiative.

Of China’s big fab initiatives, only two remain in play: Yangtze Memory for NAND and ChangXin Memory For DRAM.

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Hi Wangxi,

At least both NAND and DRAM project had a Fabricator, Hope both of them succeed. Sanity prevail at Tsinghua group and gov't intervention had wisely stop anymore wasteful investment.
 
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Orthan

Senior Member
Wangxi said:
Of China’s big fab initiatives, only two remain in play: Yangtze Memory for NAND and ChangXin Memory For DRAM.
Click to expand...

Yangtze Memory gets 80% of its chip equipment from the US and japan. Thats not a good thing.

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And ChangXin Memory has problems with Micron. And i bet that it also depends on US tech.

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