Chinese semiconductor industry


tokenanalyst

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YMTC preps second Wuhan wafer fab for NAND flash​

YMTC preps second Wuhan wafer fab for NAND flash



China’s national champion NAND flash producer Yangtze Memory Technology Co. Ltd. is planning to bring its second wafer fab online in Wuhan by the end of 2022, according to a Nikkei report. Despite a memory market headed towards saturation and with falling prices YMTC appears to be determined to carry…

China’s national champion NAND flash producer Yangtze Memory Technology Co. Ltd. is planning to bring its second wafer fab online in Wuhan by the end of 2022, according to a Nikkeireport.

Despite a memory market headed towards saturation and with falling prices YMTC appears to be determined to carry on gaining market share.
The company was founded in 2016 as a subsidiary of China’s Tsinghua Unigroup, which owns 51 percent of the company. It has moved from about 1 percent market share in global NAND production in 2019 to 4.5 percent in 2021.

Ramping market share​

The main fab in Wuhan is reportedly capable of 100k wafer starts per month and it is said Fab 2 will be eventually capable of running 200k wafer starts per month. This could help YMTC double its market share.

YMTC successfully brought in 128-layer 3D-NAND flash production at about the same time as other memory companies and this now represents 40 percent of its output. It is reported that YMTC plans to skip the 192-layer generation and move directly to 232 layers.
It was reported in March that Apple was testing NAND flash memory chips from YMTC with a view to including the Chinese company as a supplier for the iPhone 14.

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tokenanalyst

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Xinde Technology Advanced Packaging Technology Research Institute was established​


"Xinde Advanced Packaging Research Institute" independently established by Xinde Technology has gathered top experts in the field of integrated circuit packaging in China. The scientific research results produced after the gathering will definitely be able to break through the bottleneck of domestic advanced packaging and form a batch of landmark achievements. , leading the progress of China's advanced packaging technology, and at the same time has a positive significance and impact on the development of the entire advanced packaging supply chain. It is understood that the localization rate of equipment in the advanced packaging product line of Xinde Technology has reached 90%. It is believed that under the guidance of the research institute, This figure must be able to reach 99%, and then lead a large number of domestic equipment manufacturers and material manufacturers to occupy the domestic and foreign markets.

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Rettam Stacf

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YMTC preps second Wuhan wafer fab for NAND flash​

YMTC preps second Wuhan wafer fab for NAND flash



China’s national champion NAND flash producer Yangtze Memory Technology Co. Ltd. is planning to bring its second wafer fab online in Wuhan by the end of 2022, according to a Nikkei report. Despite a memory market headed towards saturation and with falling prices YMTC appears to be determined to carry…

China’s national champion NAND flash producer Yangtze Memory Technology Co. Ltd. is planning to bring its second wafer fab online in Wuhan by the end of 2022, according to a Nikkeireport.

Despite a memory market headed towards saturation and with falling prices YMTC appears to be determined to carry on gaining market share.
The company was founded in 2016 as a subsidiary of China’s Tsinghua Unigroup, which owns 51 percent of the company. It has moved from about 1 percent market share in global NAND production in 2019 to 4.5 percent in 2021.

Ramping market share​

The main fab in Wuhan is reportedly capable of 100k wafer starts per month and it is said Fab 2 will be eventually capable of running 200k wafer starts per month. This could help YMTC double its market share.

YMTC successfully brought in 128-layer 3D-NAND flash production at about the same time as other memory companies and this now represents 40 percent of its output. It is reported that YMTC plans to skip the 192-layer generation and move directly to 232 layers.
It was reported in March that Apple was testing NAND flash memory chips from YMTC with a view to including the Chinese company as a supplier for the iPhone 14.

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The world memory market is indeed rapidly heading towards saturation.

But YMTC's aggressive capacity expansion makes sense. YMTC, as long as its products are competitive, should not have problem finding eager Chinese and non-Chinese customers who want to minimize their business risk of depending on foreign memory chips. And every memory IC displaced by YMTC or other Chinese memory manufacturers will further exasperate the already saturated market outside of China.

Non-Chinese memory IC suppliers are looking at a pretty grim future right now.
 

henrik

Junior Member
Registered Member
The world memory market is indeed rapidly heading towards saturation.

But YMTC's aggressive capacity expansion makes sense. YMTC, as long as its products are competitive, should not have problem finding eager Chinese and non-Chinese customers who want to minimize their business risk of depending on foreign memory chips. And every memory IC displaced by YMTC or other Chinese memory manufacturers will further exasperate the already saturated market outside of China.

Non-Chinese memory IC suppliers are looking at a pretty grim future right now.
The Chinese are going to displace the flash chips business of some of these pesky east Asian vassal states.
 

ansy1968

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Registered Member
So will TSMC Arizona FAB be finished by 2024? have it received Federal subsidies it was promise for? Intel the favored son hadn't experience such difficulties...lol

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Chip makers are refusing to build new semiconductor plants in the U.S. unless Congress unlocks $52 billion in funding​

BY
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June 28, 2022 2:13 PM GMT+8
U.S. Commerce Secretary Gina Raimondo
GlobalWafers’ $5 billion chip factory depends on Congress funding the CHIPS Act, U.S. Commerce Secretary Gina Raimondo says.TING SHEN—BLOOMBERG/GETTY IMAGES


The world’s third-largest maker of semiconductor wafers, Taiwan’s GlobalWafers,
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$5 billion factory in the U.S. on Monday—but only if the government helps pay for it.

“This investment that they’re making is contingent upon Congress passing the CHIPS Act. The [GlobalWafers] CEO told me that herself, and they reiterated that today,” U.S. Commerce Secretary Gina Raimondo told CNBC, the same day GlobalWafers announced its development plan.
Congress actually
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the CHIPS Act, which proposed $52 billion in
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for local players to invest in the domestic chip industry, in January 2021 as part of that year’s National Defense Authorization Act—an annual bill designed to provide guidance on policies and funding for the year. But, over a year later, Congress has yet to formally allocate any budget to finance the bill.
“It has to be done before [Congress goes] to August recess. I don’t know how to say it any more plainly. [The GlobalWafers] deal…will go away, I think, if Congress doesn’t act,” Raimondo told CNBC.
The CHIPS Act is intended to shore up America’s flagging chip industry as a hedge against China’s accelerated development of its own semiconductor capabilities and shift global production away from China’s shores. The majority of global semiconductor manufacturing is
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, an independent island that Beijing claims sovereignty over.
Never miss a story about semiconductors



Technically, the CHIPS Act is supposed to support domestic companies—not foreign companies investing in America. But last December the U.S.-based semiconductor industry organization SEMI
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Congress to open CHIPS funding for all companies investing in the U.S.
Taiwan’s GlobalWafers, which has proposed building its new plant in Texas, isn’t the only chip industry manufacturer that has conditioned its investment in the U.S. on government funding.
In 2020,
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Manufacturing Corp. (TSMC), the world’s largest contract chip manufacturer, announced plans for a $12 billion plant in Phoenix to produce its most advanced chips. But TSMC CEO Mark Liu
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development would go ahead only if the government could “make up TSMC’s running costs difference between the United States and Taiwan.”
The State of Arizona
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at least $200 million in public infrastructure funding to support TSMC’s factory operations in Phoenix, including spending on roads and sewage systems. In June, TSMC
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construction of its Arizona fab, which is ongoing, was proving to be more costly than the company anticipated and called for Washington to extend CHIPS support to foreign firms.
Of course, domestic players want the government to help subsidize their own expansions in the U.S., too. Last week,
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put a
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on construction of its latest $20 billion factory in Ohio and postponed its groundbreaking ceremony indefinitely—or until Congress funds the CHIPS Act.

“Unfortunately, CHIPS Act funding has moved more slowly than we expected, and we still don’t know when it will get done,” Intel spokesperson Will Moss told the
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, calling on Congress to act so Intel “can move forward at the speed and scale we have long envisioned for Ohio.”
 

tokenanalyst

Captain
Registered Member

Shengmei Shanghai: I hope to break through the bottleneck of domestic semiconductor equipment, and I hope to go to the international market​


The benign development of the semiconductor industry environment has strongly stimulated the historic growth opportunities for Chinese semiconductor equipment manufacturers. Wang Hui said that in 2021, the company achieved operating income of 1.621 billion yuan, an increase of 60.88% over the same period last year; net profit attributable to owners of the parent company was 266 million yuan, an increase of 35.31% over the same period last year; Net profit excluding non-recurring gains and losses was 195 million yuan, an increase of 110.67% over the same period last year.

Shengmei Shanghai has also achieved fruitful results in terms of production R&D and customer expansion. Wang Hui pointed out that in terms of R&D innovation, the company successively released high-speed copper electroplating technology last year, expanding the product portfolio of vertical furnace semiconductor equipment and supporting more applications in the manufacturing process of logic, memory and power devices; entering the field of wet edge etching , the new products support 3D NAND, DRAM and advanced logic manufacturing processes, and also released the first electroplating equipment for wafer-level packaging and electroplating applications in compound semiconductor manufacturing, etc. The company's cleaning technology and equipment can cover more than 80%. The cleaning process of the platform company has begun to take shape. In terms of customer expansion, in addition to existing customers, five new well-known customers outside mainland China were added last year, and they received orders for Damascus electroplating equipment DEMO from major Asian integrated circuit manufacturers. This is the first time that the company's copper plating equipment has entered the international client. Domestic also continued to expand a number of customers.

"Starting from 2020, the development of the global semiconductor equipment market has accelerated, and the overall sales scale has surged from about $50 billion four or five years ago to $100 billion in 2021. Smartphones, electric vehicles, communication equipment, data centers and other applications The rapid growth of demand for semiconductors has promoted the current super economic cycle. Although the semiconductor industry itself is cyclical, from the perspective of market trends, it is expected that the current economic cycle will continue until next year.” Wang Hui believes that now The international market is slowly revealing some signs of changes in demand, but there is a time lag between the domestic market itself and the international market. The first and second echelons of equipment manufacturers have gone through years of development, their technologies are more mature, and their output has reached economical levels. However, the domestic semiconductor equipment industry has developed relatively late. From the perspective of the development cycle, the prosperity is also longer than that of the international market.​

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tokenanalyst

Captain
Registered Member

Some biddings:​

See the breakthroughs of domestic equipment manufacturers from the Q2 bidding data of mainstream fabs​


NAURA won a total of 80 equipments, Zhongwei Semiconductor won a total of 22 equipments, Xinyuan Microelectronics won a total of 24 equipments, Yitang Semiconductor won a total of 12 equipments, Tuojing Technology won a total of 11 equipments, and Zhongke Feixi won a total of 7 equipments. , Shanghai Microelectronics won a total of 6 bids, Huahai Qingke won a total of 8 bids; from the perspective of foreign equipment manufacturers, ASML won a total of 7 equipment, Fanlin Semiconductor won a total of 16 equipment, KLA won a total of 18 equipment, and Applied Materials won a total of 16 equipment. 21 sets of equipment were won, and Tokyo Electron won the bid for 87 sets of equipment.

The domestic substitution of equipment is at the right time. From the perspective of main links, domestic lithography, etching, thin film deposition and other multi-point blooms have breakthroughs at different levels.

In the lithography link , ASML won the bid for 5 lithography machines, occupying a leading position in the industry; Shanghai Microelectronics won the bid for 1 stepper lithography machine. It is understood that Shanghai Microelectronics SSX600 series step-and-scan projection lithography machine can meet the lithography process requirements of 90nm, 110nm, 280nm critical layers and non-critical layers in IC front-end manufacturing. In addition, in February this year, Shanghai Microelectronics successfully delivered the first 2.5D\3D advanced packaging lithography machine, which is of great significance to the domestic integrated circuit industry.

In the etching process , North Huachuang and China Microelectronics won the bid for 38 etching equipment in total, exceeding the total of 19 sets of Fanlin Semiconductor and Tokyo Electronics. North Huachuang won the bid for 16 etching equipment, including 13 Shanghai Jita, 1 Zhuzhou CRRC Times, 1 Peking University, and 1 Shanghai New Micro Semiconductor. North Huachuang ICP (Inductively Coupled Plasma) etching technology has obvious advantages, and its self-developed 14nm plasma silicon etching machine has successfully entered the mainstream project production line.

China Micro Semiconductor won the bid for 22 etching equipment, including 13 Hua Hong Semiconductor, 8 Shanghai Jita, and 1 Zhuzhou CRRC Times. China Micro Semiconductor CCP (capacitively coupled plasma) etching technology is excellent, covering 65 nanometers to 5 nanometers, and it is also progressing smoothly below 5 nanometers. In 2021, a total of 298 cavities of CCP etching equipment were produced and delivered, and the output increased by 40% year-on-year. %.

In the thin film deposition process , Topking Technology won the bid for 11 thin film deposition equipment, which is slightly lower than the total of 15 sets of Fanlin Semiconductor and Applied Materials. The main product series of Tuojing Technology are plasma enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment and sub-atmospheric pressure chemical vapor deposition (SACVD) equipment, which are widely used in domestic fabs for 14nm and above process integrated circuits Manufacturing production line, and has launched 10nm and below process product verification test.

At present, domestic fabs are entering a period of accelerated construction. Although the penetration rate of domestic equipment manufacturers is insufficient, they have begun to catch up with breakthroughs in lithography, etching, film deposition, glue development and other links. The orders of equipment manufacturers such as China Micro Semiconductor and Tuojing Technology have surged, and the progress has been obvious. (Proofreading/Ruobing)

Keep in mind the biddings are just a part of the total sales of semiconductor equipment and software.
 
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tokenanalyst

Captain
Registered Member

Huafeng Measurement and Control: The next generation of products will be basically completed within this year. The company has been seeking merger and acquisition opportunities​

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The R&D pace is better than expected, and the next-generation products are basically completed

Huafeng Measurement and Control's current products are mainly divided into two categories: STS 8200 series testing machine and STS 8300 digital-analog hybrid testing machine. Some products account for more than 60% of the domestic market, and the company expects to follow the industry to maintain steady growth in the future.

STS 8300 is a new test system launched by the company in 2018, mainly for PMIC and power SoC testing, which can meet the test requirements of FT and CP at the same time. From the perspective of technical parameters, the company's STS 8300 is currently a 100M board, and 200M and 400M will be launched one after another. As an entry-level product for SoC testing, the STS 8300 will increase its overall revenue to about 15% in 2021, and the company expects to maintain a high growth rate in 2022.

Sun Yi said that the company's first-generation STS8300 products have basically reached the expected state, and the next-generation products will be oriented to larger-scale SoC product technologies. At present, the next-generation products are already in progress according to the planned rhythm. The whole machine, system and wiring have been completed, and the prototype will be basically completed within the year. The overall R&D pace is faster than expected.
 

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