Chinese semiconductor industry

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gelgoog

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I told you guys it was a bad idea to sell NAND to Apple. YMTC should at least have waited until they finished their own capacity expansion.
The Chinese market is large enough they do not need Apple for anything.

YMTC competes in lower end of the NAND market which is the place US Micron typically occupies but CN YMTC memory has better performance characteristics. This is all about keeping Micron in their position.
 
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tokenanalyst

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What a farce!

They are "concerned" because maybe YMTC has provided memory for the Mate Xs 2, when Qualcomm and many other US supplier have provided for sure the Snapdragon and other IC for the same Mate Xs 2 phone!

They just want to punish YMTC because it dared to sell to Apple...that's the very petty truth.

Looking at what YTMC is doing lately, I'd expect that YMTC is already well prepared to end up in the entity list...actually it is quite surprising to me it is still out of the list.
According to a report I read about the company, they probably have one highest localization rate in China.
 

tokenanalyst

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Do this people sleep?

[Hechuangnest · Chuangpin 100] Integrated circuit reticle defect detection product i6R: let reticle defects have nowhere to hide​



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Royal Micro Semiconductor: Reticle defect inspection product i6R

The i6R, the country's first integrated circuit mask defect detection product independently developed and launched by Yuwei Semiconductor, has reached the international advanced level in its key performance and has obtained the SEMI S2 certification of the Global Semiconductor Association. The product has surpassed foreign manufacturers with its excellent performance and stable performance. Monopoly, approved by TSMC, the world's largest integrated circuit manufacturer, and obtained repeated orders. At present, the products have been verified and used in the production lines of many integrated circuit manufacturers.

This product is mainly used to detect various common defects such as particles, oil stains, scratches on the upper surface and the lower surface of the reticle, and has a high detection rate and yield. Adopting high-resolution imaging, multi-mode lighting system, big data transmission, high-precision motion platform, high-efficiency multi-film library transmission, high-flow clean air bath and other technologies, the problems of low photomask detection efficiency, slow speed and poor process adaptability are solved. , has the characteristics of high resolution, high detection rate, high yield, particle cleaning, factory automation , etc., can accurately and quickly determine the location, size and shape of defects, more convenient for engineers to analyze and solve problems, and create value for customers.

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tokenanalyst

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Interesting research on LPP EUV light sources by this team in China

Abstract

Extreme ultraviolet lithography (EUVL) has been demonstrated to meet the industrial requirements of new-generation semiconductor fabrication. The development of high-power EUV sources is a long-term critical challenge to the implementation of EUVL in high-volume manufacturing (HVM), together with other technologies such as photoresist and mask. Historically, both theoretical studies and experiments have clearly indicated that the CO2 laser-produced plasma (LPP) system is a promising solution for EUVL source, able to realize high conversion efficiency (CE) and output power. Currently, ASML's NXE:3400B EUV scanner configuring CO2 LPP source system has been installed and operated at chipmaker customers. Meanwhile, other research teams have made different progresses in the development of LPP EUV sources. However, in their technologies, some critical areas need to be further improved to meet the requirements of 5 nm node and below. Critically needed improvements include higher laser power, stable droplet generation system and longer collector lifetime. In this paper, we describe the performance characteristics of the laser system, droplet generator and mirror collector for different EUV sources, and also the new development results.

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advancing from 2015
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FairAndUnbiased

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Interesting research on LPP EUV light sources by this team in China

Abstract

Extreme ultraviolet lithography (EUVL) has been demonstrated to meet the industrial requirements of new-generation semiconductor fabrication. The development of high-power EUV sources is a long-term critical challenge to the implementation of EUVL in high-volume manufacturing (HVM), together with other technologies such as photoresist and mask. Historically, both theoretical studies and experiments have clearly indicated that the CO2 laser-produced plasma (LPP) system is a promising solution for EUVL source, able to realize high conversion efficiency (CE) and output power. Currently, ASML's NXE:3400B EUV scanner configuring CO2 LPP source system has been installed and operated at chipmaker customers. Meanwhile, other research teams have made different progresses in the development of LPP EUV sources. However, in their technologies, some critical areas need to be further improved to meet the requirements of 5 nm node and below. Critically needed improvements include higher laser power, stable droplet generation system and longer collector lifetime. In this paper, we describe the performance characteristics of the laser system, droplet generator and mirror collector for different EUV sources, and also the new development results.

View attachment 98048

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advancing from 2015
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Studies like the aging effect on multilayer mirrors and Sn debris management is foundational groundwork for a next generation LPP source, just like original experiments on EUV photopolymerization of contaminants on optics surfaces, hard mask resists, etc were what brought EUV from the post experimental, pre deployment stage to the road towards commercial acceptance.
 

tokenanalyst

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Studies like the aging effect on multilayer mirrors and Sn debris management is foundational groundwork for a next generation LPP source, just like original experiments on EUV photopolymerization of contaminants on optics surfaces, hard mask resists, etc were what brought EUV from the post experimental, pre deployment stage to the road towards commercial acceptance.
They are also proposing a kind of type of tin droplet "nano" generator with high efficiency. Let see how this will develop in the future.
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Nutrient

Junior Member
Registered Member
I told you guys it was a bad idea to sell NAND to Apple. YMTC should at least have waited until they finished their own capacity expansion.
The Chinese market is large enough they do not need Apple for anything.
Apple's adoption of YMTC's NAND flash chip should help YMTC a lot. For one thing, it shows that YMTC has reached the world level in technology, quality, and price. Before Apple's decision, other manufacturers -- even in China -- were probably worried about quality and therefore were reluctant to buy YMTC's products. Now they will buy and buy. The future of YMTC looks bright.


YMTC competes in lower end of the NAND market which is the place US Micron typically occupies but CN YMTC memory has better performance characteristics. This is all about keeping Micron in their position.
That is possible. Maybe the South Koreans (Samsung and SK Hynix) should watch their backs.
 

henrik

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Registered Member
What a farce!

They are "concerned" because maybe YMTC has provided memory for the Mate Xs 2, when Qualcomm and many other US supplier have provided for sure the Snapdragon and other IC for the same Mate Xs 2 phone!

They just want to punish YMTC because it dared to sell to Apple...that's the very petty truth.

Looking at what YTMC is doing lately, I'd expect that YMTC is already well prepared to end up in the entity list...actually it is quite surprising to me it is still out of the list.

They will just put micron on the entity list.
 
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