Chinese semiconductor industry

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tokenanalyst

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Royal Micro Semiconductor wafer defect inspection equipment was sent to SMIC Beijing for the first time​


On May 30, 2022, the i12-F200 wafer defect inspection equipment of Yuwei Semiconductor was sent to SMIC Beijing for the first time.
The i12-F200 wafer defect inspection equipment shipped this time is mainly used for common defect inspection on 12-inch wafer production lines. It has the product characteristics of high efficiency, high detection rate, intelligence, comprehensiveness, and factory automation, and can effectively identify Small defects in silicon wafers, improve defect detection rate. Royal Micro Semiconductor will continue to provide high-performance products to help SMIC Jingcheng production line improve yield and create value for customers.
In the future, Royal Micro will continue to make every effort to promote the research and development of key technologies for ultra-high-precision volume testing in the fields of integrated circuit manufacturing, advanced packaging, compound semiconductors, and new displays, so as to provide independent and controllable assistance for relevant core technologies in the field of semiconductor volume testing in China.

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tokenanalyst

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Royal Micro Semiconductor Technology Co., Ltd.

Royal Micro Semiconductor is a scientific and technological innovation enterprise that provides advanced equipment for integrated circuit manufacturing driven by the two-wheel drive of market and technology. The company provides customers with competitive products and technical solutions for the fields of integrated circuit manufacturing, advanced packaging, compound semiconductors, and new displays. The company focuses on the design and system integration of integrated circuit optical quality inspection systems, and around the autonomy of integrated circuit equipment, it has formed 6 categories of quality inspection products in four major fields, including reticle inspection, wafer inspection, pan-semiconductor inspection, and wafer measurement. Committed to becoming the world's first echelon of integrated circuit equipment technology providers.

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tokenanalyst

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Hefei Xinyihua completed 12inch semiconductor AMHS system development and technical specification verification​


Hefei Xinyihua Intelligent Machinery Co., Ltd. (hereinafter referred to as "Hefei Xinyihua"), as a pan-semiconductor intelligent manufacturing overall solution provider, has completed the development of the 12inch semiconductor automatic material handling system AMHS (Automatic Material Handling System) and the operation of the Demo system , and passed the technical specification verification.
Chip manufacturing has high requirements on process and environment - advanced 12inch semiconductor factories require a clean and dust-free environment, and have high requirements for automation and intelligence in the operation of the entire factory, which makes how to improve the space utilization of the entire clean factory and reduce The idle time of the machine, improving production efficiency and product yield have become its most concerned issues. The AMHS system of the 12inch semiconductor manufacturing plant consists of various hardware devices (OHT, OHB, OHCV, Stocker, Lifter, NTB, etc.) and software systems (MCS, OCS, STKC, etc.). The AMHS system can realize unmanned automatic transportation between complex processes in a clean environment, improving operational efficiency while ensuring quality and yield. Therefore, the AMHS system is the first choice for large-scale mass production of 12inch advanced process fabs to improve production efficiency. With the development of industry technology, AMHS will also be widely used in various semiconductor manufacturing processes such as 12-inch silicon wafer manufacturing, chip manufacturing, and advanced packaging.

The transport efficiency, wafer protection, motion accuracy and other performance indicators of Hefei Xinyihua AMHS system have reached the international advanced level, and it has a unique path search algorithm patent and has the ability to intelligently dispatch large-scale vehicles. Among them, the self-developed high-speed OHT products have industry-leading technical specifications and reliability, and can run smoothly at high speeds of up to 320m/min. At the same time, technical indicators such as high-speed vibration data, transfer speed, and anti-collision control between vehicles Comparing with the top suppliers in the industry. Hefei Xinyihua OHT has a maximum load of 15 kg, which can correspond to products in various manufacturing processes, and has the ability to control 200 vehicles at the same time in a single loop.

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sunnymaxi

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little old news but really significant. really really a big breakthrough done by China academy of science.

The domestic first self-developed terahertz scanning tunneling microscope system has been successfully developed in Guangzhou

Recently, the Aerospace Information Research Institute of the Chinese Academy of Sciences (Guangzhou Park)-Guangdong Greater Bay Area Aerospace Information Research Institute (hereinafter referred to as the "Greater Bay Area Research Institute") successfully developed a terahertz scanning tunneling microscope system, which is superior to the atomic level. (Angstrom-level) spatial resolution and better than 500 femtosecond temporal resolution, becoming the first self-developed terahertz scanning tunneling microscope system in China.

Scanning Tunneling Microscopy (STM) is a scanning probe microscopy tool for observing and locating single atoms, through the atomic-scale tip, at a height of less than one nanometer, to scan and image different samples with ultra-high precision. At low temperature, STM can precisely manipulate single molecules or atoms with the probe tip. It is not only an important micro-nano-scale measurement tool, but also a potential micro-nano processing tool. It can scan at the atomic level, detect and repair material surfaces, and guide microscopic chemical reactions. , control of atomic arrangement and other fields are widely used. However, conventional electrical modulation rates limit STM observations at higher temporal resolutions (generally on the order of microseconds). In 2013, Frank Hegmann, a professor at the University of Alberta in Canada , combined terahertz pulses and STM for the first time to achieve sub-picosecond time resolution and nanometer spatial resolution. Subsequently, German, American and other scientific research teams have carried out related technical research.

It took nearly 12 months for the terahertz research team of the Greater Bay Area Research Institute to break through the core key technologies such as terahertz and scanning tunnel tip coupling, terahertz pulse phase modulation, and successfully developed the first domestic terahertz scanning tunneling microscope (THz-STM). ). The microscope has Angstrom-level spatial resolution and sub-picosecond temporal resolution (improved by more than 1 million times), and can achieve precise detection (femtosecond-Angstrom level) with high temporal and spatial resolution at the same time. The ultrafast kinetic process of electrons provides a powerful technical means, which can be used in new quantum materials, micro-nano optoelectronics, biomedicine, ultrafast chemistry and other fields.

The research was funded by the National Natural Science Foundation of China Terahertz Basic Science Center, Guangdong Provincial Department of Science and Technology, Guangzhou City, Huangpu Development Zone and other related projects.

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Electron microscope technology can be used for metrology like the tools made by KLA-Tencor. It’s crucial to the semiconductor industry. The ultrafast kinetic process of electrons provides a powerful technical means, also can be used in new quantum materials, micro-nano optoelectronics, biomedicine, ultrafast chemistry and other fields.
 

ansy1968

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Royal Micro Semiconductor wafer defect inspection equipment was sent to SMIC Beijing for the first time​


On May 30, 2022, the i12-F200 wafer defect inspection equipment of Yuwei Semiconductor was sent to SMIC Beijing for the first time.
The i12-F200 wafer defect inspection equipment shipped this time is mainly used for common defect inspection on 12-inch wafer production lines. It has the product characteristics of high efficiency, high detection rate, intelligence, comprehensiveness, and factory automation, and can effectively identify Small defects in silicon wafers, improve defect detection rate. Royal Micro Semiconductor will continue to provide high-performance products to help SMIC Jingcheng production line improve yield and create value for customers.
In the future, Royal Micro will continue to make every effort to promote the research and development of key technologies for ultra-high-precision volume testing in the fields of integrated circuit manufacturing, advanced packaging, compound semiconductors, and new displays, so as to provide independent and controllable assistance for relevant core technologies in the field of semiconductor volume testing in China.

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@tokenanalyst bro so part of this project, SMIC DUAL Approach with Shanghai using ASML and Beijing using SMEE and all domestic.

From CnTechPost

SMIC builds $7.7 billion fab in Beijing, first phase expected to be completed by 2024​

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February 23, 2021
Semiconductor Manufacturing International Corporation (SMIC), China's leading contract chipmaker, has invested RMB 49.7 billion ($7.7 billion) in a fab in Beijing, with the first phase of the project scheduled for completion in 2024.
SMIC, together with China Integrated Circuit Investment Industry Fund and Beijing E-Town International Investment & Development Co Ltd, established SMIC Jingcheng Integrated Circuit Manufacturing on December 7, 2020, which was
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by the Beijing Yizhuang Developer Government on February 23.
SMIC Jingcheng's Phase I project is currently under construction and is expected to cost approximately RMB 7.6 billion and will have a capacity of approximately 100,000 12-inch wafers per month upon completion.
SMIC builds $7.7 billion fab in Beijing, first phase expected to be completed by 2024-CnTechPost

(SMIC's fab phase I project site in Beijing)

The area of the SMIC Jingcheng Phase I project is approximately 240,000 square meters, including the FAB3P1 production plant and supporting buildings and structures.
SMIC has multiple 8-inch and 12-inch production sites in Shanghai, Beijing, Tianjin, and Shenzhen, China, with a combined capacity of 450,000 wafers per month (on an 8-inch basis) as of the end of 2019.
SMIC's market share in 2019 is approximately 5%, ranking 5th globally, with a 16% market share in China.
 
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