Chinese semiconductor industry

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ansy1968

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Ali's 3D stacking chip breakthrough

Alibaba successfully developed a new architecture chip. This chip is the world's first DRAM-based 3D bonded stacked storage and computing integrated AI chip, which can break through the performance bottleneck of the von Neumann architecture and meet the needs of artificial intelligence and other scenarios for high bandwidth, high capacity memory and extreme computing power. In certain AI scenarios, the performance of the chip is increased by more than 10 times, and the energy efficiency ratio is increased by up to 300 times.

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@foofy Sir all well and good, the question still remain, who will FAB it?
 

ansy1968

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From my friend @Oldschool.

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Cansemi bringing 12 inch wafer capibility to analog and mixed signal product.
For example, 0.13um 12 inches BCD mixed tech. Bipolar for analog and CMOS for digital and Double Diffused MOS for power.

Power management, motor control IC and other analog chips.

doing a solid job , running full production
 

ChongqingHotPot92

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If you go to page 14-15, here is what it says.

以军用 IGBT 芯片为例,100%依赖进口; 以军用 FPGA 芯片为例,95%依赖进口。

"For military-grade IGBT, 100% reliance on import. For military-grade FPGA, 95% reliance on import."

Can someone please explain what is going on is this doc? I am not an expert in finance and do not have the political background clearance to know the exact level of PLA reliance on imported chips!
 
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SanWenYu

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If you go to page 14-15, here is what it says.

以军用 IGBT 芯片为例,100%依赖进口; 以军用 FPGA 芯片为例,95%依赖进口。

"For military-grade IGBT, 100% reliance on import. For military-grade FPGA, 95% reliance on import."

Can someone please explain what is going on is this doc? I am not an expert in finance and do not have the political background clearance to know the exact level of PLA reliance on imported chips!
I had a quick scan. Some claims made by this report sound sketchy or outdated to me. For example, it has the following in chart 14 (图表 14) on page 12:

PL-15 2015 年试射 2017 年已经服役 大型导弹(长超过6 米),射程超过 300 甚至400 公里,可用于歼20

"PL-15, first tested in 2015, went into service in 2017, large missle with length over 6 meters, range over 300 to 400 kms, for J-20"

Is this really the PL-15 AA missle that we know of?

In chart 35 on page 23, it also claims that "The WZ-10 engine (for Z-20) is still in development". Consider that this report was published on June 1, 2021, this is obviously outdated.
 

Xizor

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If you go to page 14-15, here is what it says.

以军用 IGBT 芯片为例,100%依赖进口; 以军用 FPGA 芯片为例,95%依赖进口。

"For military-grade IGBT, 100% reliance on import. For military-grade FPGA, 95% reliance on import."

Can someone please explain what is going on is this doc? I am not an expert in finance and do not have the political background clearance to know the exact level of PLA reliance on imported chips!
Translated document :
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Xizor

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I had a quick scan. Some claims made by this report sound sketchy or outdated to me. For example, it has the following in chart 14 (图表 14) on page 12:



"PL-15, first tested in 2015, went into service in 2017, large missle with length over 6 meters, range over 300 to 400 kms, for J-20"

Is this really the PL-15 AA missle that we know of?

In chart 35 on page 23, it also claims that "The WZ-10 engine (for Z-20) is still in development". Consider that this report was published on June 1, 2021, this is obviously outdated.
Good find. So the rigor of the paper regarding fine details can be questioned. But then again, we can learn about various mid stream enterprises and companies that supply Chinese military ( at least their names and products offered).

The thing on semiconductors maybe dismissed. Never read of it anywhere, except that FPGAs have been hard nut to crack for China ( but one china started cracking nevertheless). Although there indeed is a lag in very high end semiconductors (CPU,GPU) but that has to do with broader fabrication lag which we all know.
 
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