Chinese semiconductor industry

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ansy1968

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HwaTsing Co. Ltd. successfully launched the 12-inch ultra-precision wafer thinning machine Versatile-GP300 with independent intellectual property rights, which was shipped to a customer's large production line on September 27.

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@foofy Sir from the article I highlighted in bold part, does this mean that China had been making progress in 3D stacking tech?

This equipment can meet the ultra-precision wafer thinning process requirements of 3D IC manufacturing, advanced packaging and other processes. It can provide ultra-precision grinding, polishing, post-cleaning and other functional configurations. It has high rigidity, high precision, and flexible process development. And other advantages, the main technical indicators have reached the international advanced level, filling the gap of ultra-precision thinning technology in the field of integrated circuit 3D IC manufacturing and advanced packaging.
 

foofy

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@foofy Sir from the article I highlighted in bold part, does this mean that China had been making progress in 3D stacking tech?

This equipment can meet the ultra-precision wafer thinning process requirements of 3D IC manufacturing, advanced packaging and other processes. It can provide ultra-precision grinding, polishing, post-cleaning and other functional configurations. It has high rigidity, high precision, and flexible process development. And other advantages, the main technical indicators have reached the international advanced level, filling the gap of ultra-precision thinning technology in the field of integrated circuit 3D IC manufacturing and advanced packaging.
yes. 3d stacking is one of the few areas where china is leading.
 

dfrtyhgj

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TCL CSOT will establish joint labs with multiple upstream and downstream firms such as Longli Technology, Lenovo, and Huawei affiliate HiSilicon, said the company. TCL CSOT will invest CNY10 billion (USD1.5 billion) in core links of the industry chain, working closely with universities and research institutes
 

gadgetcool5

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IMEC: The brain trust at the heart of the $550bn semiconductor industry

EUV is a delicate process involving high-powered lasers, molten tin and ultra-smooth mirrors. The bus-sized machines that generate EUV are today all made by ASML and used by TSMC and Samsung, a South Korean chipmaker. It took 20 years of R&D to turn the idea into manufacturing reality. IMEC acted as a conduit in that process. That is because EUV must work seamlessly with kit made by other firms. Advanced toolmakers want a way to circulate their intellectual property (IP) without the large companies gaining sway over it. The large companies, meanwhile, do not want to place all their bets on any one experimental idea that is expensive (as chipmaking processes are) and could become obsolete.

IMEC’s neutrality allows both sides to get around this problem. It collects all the necessary gear in one place, allowing producers to develop their technology in tandem with others. And everyone gets rights to the IP the institute generates. Mr Van den hove says that progress in the chip industry has been driven by the free exchange of knowledge, with IMEC acting as a “funnel” for ideas from all over the world.

This model has lured ever more contributors. Today “several hundred” are active at IMEC at any one time, the institute says. They range from startups to the stars of the chipmaking firmament, from ASML to TSMC. Pat Gelsinger, Intel’s newish boss, is effusive in his praise for the outfit. Even as their number has grown, individual partners have also become more generous, in part to keep pace with the rising price of all the chipmaking equipment that IMEC must procure (even if it gets a lot of it from collaborators at reduced rates). As a result, IMEC’s revenues, which come from the research contracts and from prototyping and design services, doubled between 2010 and 2020, to €678m ($773m). Its annual takings are already on the order of those of giant charities such as the Ford Foundation or the American Cancer Society, and growing roughly in line with the booming chip business (see chart).

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Topazchen

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IMEC: The brain trust at the heart of the $550bn semiconductor industry

EUV is a delicate process involving high-powered lasers, molten tin and ultra-smooth mirrors. The bus-sized machines that generate EUV are today all made by ASML and used by TSMC and Samsung, a South Korean chipmaker. It took 20 years of R&D to turn the idea into manufacturing reality. IMEC acted as a conduit in that process. That is because EUV must work seamlessly with kit made by other firms. Advanced toolmakers want a way to circulate their intellectual property (IP) without the large companies gaining sway over it. The large companies, meanwhile, do not want to place all their bets on any one experimental idea that is expensive (as chipmaking processes are) and could become obsolete.

IMEC’s neutrality allows both sides to get around this problem. It collects all the necessary gear in one place, allowing producers to develop their technology in tandem with others. And everyone gets rights to the IP the institute generates. Mr Van den hove says that progress in the chip industry has been driven by the free exchange of knowledge, with IMEC acting as a “funnel” for ideas from all over the world.

This model has lured ever more contributors. Today “several hundred” are active at IMEC at any one time, the institute says. They range from startups to the stars of the chipmaking firmament, from ASML to TSMC. Pat Gelsinger, Intel’s newish boss, is effusive in his praise for the outfit. Even as their number has grown, individual partners have also become more generous, in part to keep pace with the rising price of all the chipmaking equipment that IMEC must procure (even if it gets a lot of it from collaborators at reduced rates). As a result, IMEC’s revenues, which come from the research contracts and from prototyping and design services, doubled between 2010 and 2020, to €678m ($773m). Its annual takings are already on the order of those of giant charities such as the Ford Foundation or the American Cancer Society, and growing roughly in line with the booming chip business (see chart).

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China needs to have such a CPU like organization for its semiconductor industry.
It makes interoperability for the various equipment seamless
 
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