Chinese semiconductor thread II
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Silan Micro establishes semiconductor company in Xiamen
Qichacha APP showed that Xiamen Shilan Jihong Semiconductor Co., Ltd. was established, with the legal representative Chen Xiangdong and a registered capital of 20 million yuan. The business scope includes: integrated circuit design; integrated circuit chip and product manufacturing; integrated circuit manufacturing; integrated circuit sales; semiconductor discrete device manufacturing; semiconductor discrete device sales, etc. Qichacha’s equity penetration shows that the company is wholly owned by Silanwei.
Public information shows that Silan Micro will continue to increase its R&D investment in new products such as analog circuits, power devices, power modules, MEMS sensors, and silicon carbide MOSFETs in 2023, and increase its R&D investment in automotive-grade power modules and new energy power modules. , its research and development expenses increased by about 22% year-on-year. In addition, its subsidiary Silan Ming Gallium has the production capacity of 3,000 6-inch SiC-MOSFET chips per month, and the existing production capacity is fully loaded. At the same time, it is accelerating the purchase, installation and debugging of project equipment, and is expected to have a monthly production capacity of 12,000 6-inch SiC chips by the end of 2024.
Public information shows that Silan Micro will continue to increase its R&D investment in new products such as analog circuits, power devices, power modules, MEMS sensors, and silicon carbide MOSFETs in 2023, and increase its R&D investment in automotive-grade power modules and new energy power modules. , its research and development expenses increased by about 22% year-on-year. In addition, its subsidiary Silan Ming Gallium has the production capacity of 3,000 6-inch SiC-MOSFET chips per month, and the existing production capacity is fully loaded. At the same time, it is accelerating the purchase, installation and debugging of project equipment, and is expected to have a monthly production capacity of 12,000 6-inch SiC chips by the end of 2024.
Shanxi Huaxin Semiconductor Crystal Materials Industrial Base Sapphire Crystal has achieved mass production
The production plant area of Shanxi Huaxin Semiconductor Crystal Materials Industry Base is in full swing: machines are roaring, assembly lines are running at high speed, and they are striving for a good start in the first quarter. This base is one of the third-generation semiconductor industry chain strengthening projects that Shanxi Province vigorously implements the whole industry chain cultivation project, and plays an important role in promoting the transformation and development of the province.
Shanxi Huaxin Semiconductor Crystal Materials Industrial Base mainly grows and develops a variety of semiconductor materials, among which sapphire crystal growth is the main one. It is commonly known as aluminum oxide single crystal form, also called corundum. It has high strength, high hardness, erosion resistance, and is a comprehensive Combining excellent optical, physical and chemical properties, it is an important basic material in modern industry. Its main products are semiconductor wafer substrates, and its application fields are LED display chips, especially high-end display products such as MiniLED and MicroLED, which are also widely used in consumer electronics and high-end optoelectronic windows.
Shanxi Huaxin Semiconductor Crystal Materials Industrial Base mainly grows and develops a variety of semiconductor materials, among which sapphire crystal growth is the main one. It is commonly known as aluminum oxide single crystal form, also called corundum. It has high strength, high hardness, erosion resistance, and is a comprehensive Combining excellent optical, physical and chemical properties, it is an important basic material in modern industry. Its main products are semiconductor wafer substrates, and its application fields are LED display chips, especially high-end display products such as MiniLED and MicroLED, which are also widely used in consumer electronics and high-end optoelectronic windows.
Reuters) - The U.S. government is urging the Netherlands, Germany, South Korea and Japan to further tighten curbs on China's access to semiconductor technology, Bloomberg News reported on Wednesday.
The U.S. wants Japanese companies to limit exports to China of specialized chemicals required for chipmaking, including photoresist, the report said citing people familiar with the matter.
Washington is also pressing the Netherlands to stop semiconductor equipment maker ASML from servicing and repairing chipmaking equipment for Chinese clients bought before limits on sales of those devices were put in place this year, the report added.
The US also wants to draw more countries into its export-control blockade. The Biden administration is trying to bring Germany and South Korea into an agreement that already includes Japan and the Netherlands, since all four countries are home to key firms in the semiconductor supply chain, according to the people.
For Germany, one of the critical players is Carl Zeiss AG, a specialized glass maker that supplies ASML with the optical components necessary for advanced chip production. The US wants Germany to get Zeiss to pull back from shipping such components to China, the people said.
Dutch officials also hope that Germany will join the export control group, according to the people, and the Biden administration is pushing for an agreement before the G7 summit in June. Berlin last year mulled over whether to restrict exports of chip chemicals to China, but Chancellor Olaf Scholz, who is slated to visit China in April, has not yet taken a stance on the issue, according to the person. Scholz’s deputy Robert Habeck, meanwhile, is visiting the US this week and will meet Raimondo during his trip.
In addition, the US has held talks with South Korea on chip export controls, given the country’s leading role in producing chips and supplying spare parts for chip-making equipment. The two countries launched a structured dialogue in February after US officials asked their counterparts in Seoul to join the multilateral group last year, according to some of the people.
For Germany, one of the critical players is Carl Zeiss AG, a specialized glass maker that supplies ASML with the optical components necessary for advanced chip production. The US wants Germany to get Zeiss to pull back from shipping such components to China, the people said.
Dutch officials also hope that Germany will join the export control group, according to the people, and the Biden administration is pushing for an agreement before the G7 summit in June. Berlin last year mulled over whether to restrict exports of chip chemicals to China, but Chancellor Olaf Scholz, who is slated to visit China in April, has not yet taken a stance on the issue, according to the person. Scholz’s deputy Robert Habeck, meanwhile, is visiting the US this week and will meet Raimondo during his trip.
In addition, the US has held talks with South Korea on chip export controls, given the country’s leading role in producing chips and supplying spare parts for chip-making equipment. The two countries launched a structured dialogue in February after US officials asked their counterparts in Seoul to join the multilateral group last year, according to some of the people.
Trump has blocked the long-term development path of the Western semiconductor industry... trade war (blocked all western technology flowing to China) then banned Huawei from using western IP tech...
now they don't have access to any of China's future semiconductor platforms... Chinese should be happy
12k wpm of SiC is huge. We are going to see an absolute flood of capacity coming on the market this year
here is a 8B RMB project by TySic to produce 1.5 million wafers per year of epitaxy that will start production this year and probably be fully ramped by 2026.
Sic substrate price in China is dropping like a rock. Looks like we have overcapacity here
Innoscience is look to IPO on HKSE to get $300 million in funding
Last year, it sold over 500 million GaN chips. It's products include fast chargers, phones, LED, Lidar, data center, new energy and storage It has developed auto grade product INN100W135A-Q for Lidar and High voltage inverters
It has reached 15k wpm in production of 8-inch wafers and plan to increase this to 70k wpm
Last year, it sold over 500 million GaN chips. It's products include fast chargers, phones, LED, Lidar, data center, new energy and storage It has developed auto grade product INN100W135A-Q for Lidar and High voltage inverters
It has reached 15k wpm in production of 8-inch wafers and plan to increase this to 70k wpm
Application of a machine learning method to model-based library approach for critical dimension measurements using CD-SEM
Abstract
A model-based library (MBL) method has already been established for the accurate measurement of the critical dimension (CD) of semiconductor linewidth using critical dimension scanning electron microscope (CD-SEM) images. In this work, the MBL method is further investigated by combining CD-SEM image simulation and a neural network algorithm. The secondary electron linescan profiles were first calculated using a Monte Carlo simulation method, enabling us to obtain the dependence of linescan profiles on the selected values of various geometrical parameters (e.g. top CD, sidewall angle and height) for Si and Au trapezoidal line structures. Machine learning methods have then been applied to predict the linescan profiles from a randomly selected training set of the calculated profiles. The predicted results agree very well with the calculated profiles with the standard deviations of 0.1% and 6% for the relative error distributions of Si and Au line structures, respectively. The findings show that the machine learning methods can be practically applied to the MBL method for reducing the library size, accelerating the construction of the MBL database and enriching the content of the available MBL database.