Chinese semiconductor industry

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  1. Hendrik_2000
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    I think it is about time to create a separate thread for this important segment of industry Here is the first post
    As I said before all this talk of embargo for semiconductor equipment will only spur the development of domestic semi equipment. Now all the chip maker in China is more willing to use domestic equipment and research and development of semi equipment is growing fast


    https://asia.nikkei.com/Business/Ch...es-China-s-chip-equipment-makers-room-to-grow

    CHINA TECH
    Trade war gives China's chip equipment makers room to grow
    Beijing plays down its ongoing semiconductor ambitions amid U.S. push back

    CHENG TING-FANG, Nikkei staff writer
    APRIL 11, 2019 17:16 JST

    Demand from domestic companies is expected to give a lift to China's chip industry ambitions.
    SHANGHAI/TAIPEI -- China's chip equipment makers are seeing an uptick in domestic demand thanks to the trade war, giving them an opportunity to finally gain ground on global rivals like Applied Materials and Tokyo Electron.

    Beijing-backed startup Skyverse says it will start selling its chip testing technology to major Chinese chipmakers this year, a development that Marketing Manager Leo He attributes at least partly to the trade tensions with the U.S.

    "We found that more local chip manufacturers are willing to test and try our products especially after the trade tensions escalated last year," He told the Nikkei Asian Review. "They are really keen to use domestic offerings once we can provide them. ... That's something we did not feel years ago."


    Other Chinese companies, including state-backed Naura Technology, Advanced Micro-Fabrication Equipment and Mattson Technology, also told the Nikkei Asian Review that local chipmakers have become more willing to try their products in recent months.

    While industry players acknowledge that many Chinese companies still have a long way to go in terms of technical capability, the nascent shift toward domestic equipment underscores the importance that the government is placing on the sector as a whole.

    The shift also comes as China is predicted to buck the global downturn in the chip market. Industry revenue in China, including foreign players operating in the country, is predicted to grow by more than 16%, compared with a possible global decline of 3%.

    Skyverse, founded in 2014 by scientist Chen Lu, is backed by SDIC Venture Capital, the Beijing-sponsored flagship financing program controlled by State Development and Investment Corp. The company aims to take on KLA-Tencor of the U.S., the world's biggest semiconductor testing tool provider.

    It plans to begin mass producing its chip testing tool this year. Yangtze Memory Technologies, a state-backed memory chipmaker that aims to challenge Samsung and Micron, will adopt the equipment, according to He, as will two other top local companies, Semiconductor Manufacturing International Co. and Huali Microelectronics. "It will be a landmark year for us in 2019," He said.

    China made fostering a domestic chip industry a top policy priority in 2014, after the Edward Snowden leaks the previous year revealed connections between U.S. companies and American intelligence agency's vast surveillance program.

    Only recently, however, has Beijing begun seriously supporting the nascent homegrown semiconductor equipment sector. Most resources previously went to building massive chip plants or assisting chip developers.


    This year's SEMICON China event in Shanghai drew a record 100,000 participants. (Photo by Cheng Ting-fang)
    Industry sources familiar with the matter say the big change came when the U.S. suddenly cut off supplies for telecom equipment maker ZTE and state-backed memory chipmaker Fujian Jinhua Integrated Circuit.

    The optimistic outlook for companies like Skyverse highlights not only China's ambitions, but also how far the country still has to go in terms of reducing its reliance on foreign suppliers.

    China currently has no notable players that can match the technology offerings of chip equipment titans like Applied Materials, Lam Research, KLA-Tencor, Tokyo Electron and ASML. None of the world's chip manufacturers -- including market leaders Samsung, Intel and Taiwan Semiconductor Manufacturing Co. -- would be able to produce integrated circuits without these vendors' wide range of advanced wafer-processing tools.

    Because chips are used in almost every electronic devices from smartphones to servers to connected cars and are closely connected to national security, the equipment required to produce them are also viewed as crucial weapons in the tech battle between the U.S. and China.

    "Chip equipment and materials are the segments that really take time to build," Allen Lu, president and CEO of semiconductor tool provider Mattson, told Nikkei. "Chinese semiconductor equipment makers accounted for less than 2% of the global market. ... There's still a very far way to go."

    Still, Mattson is keen to catch up. The company was acquired by a Chinese state fund in 2016, and it nearly doubled its research and development investment in 2018 to around $40 million.

    Mattson, too, sees the trade war as a positive in terms of winning local customers, according to Marketing Director Andy Zhang. "We think it's natural for local chip producers to use more domestic equipment, and we do find it's easier to approach them because of the uncertainties brought by the trade tension, and the government would definitely support this incentive, too," he said. He noted, however, that quality is still the deciding factor in success. "At the end of the day, it's only the quality of the equipment that really determines whether you can get the business deal."

    The trade war and a slowing smartphone market have hampered global chip demand, with the market predicted to decline 3% this year, according to the latest forecast by World Semiconductor Trade Statistics, one of the industry's best-known data providers.

    China remains a bright spot, however, with the domestic chip industry predicted to grow 16.2% in terms of revenue, according to data from Taipei-based research company TrendForce.

    Expectations for the Chinese market were reflected at the annual SEMICON China in Shanghai in late March, which attracted a record 100,000 industry executives and professionals.

    China is the world's biggest consumer of semiconductors, as well as the second-largest chip equipment market worldwide, behind only South Korea.

    Nevertheless, the country still imported $312 billion worth of chips in 2018 -- its top import for the year.


    Ding Wen-Wu, head of China Integrated Circuit Industry Investment Fund, the nation's top chip financing program nicknamed "the Big Fund" -- said this indicates how dependent the nation remains on foreign supplies.

    "It's still very challenging to our country as we work to become more self-reliant," Ding added.

    Ding said China needs to acknowledge the "big technology gap" between its homegrown chip players and their leading foreign peers in the U.S., Europe, South Korea and Japan. His fund, he added, is ready to welcome foreign players that want to participate in China's "buoyant and developing" semiconductor industry.

    Many foreign and domestic industry executives said Beijing has taken a slightly less aggressive tone in its public responses to the U.S. crackdown on China's tech ambition. Nevertheless, they say, the central and local governments have never scaled back their support for local chip projects.

    Jackson Hwang, co-founder and chief strategy officer of Foxsemicon Integrated Technology, a Foxconn unit making chip equipment parts for foreign customers like Applied Materials, said: "The trade tension between the world's two big powers has pushed China to be more determined than ever to build a self-reliant industry."

    "The supports from Chinese governments have never been so strong in making utilities [and] land ready and to attract more talent globally after the prolonged trade tension ... That's how I feel currently," Hwang said. Foxsemicon is currently building a new campus and logistics center in the Chinese city of Nanjing slated to begin production by the second half of next year.

    Given the global downturn, few foreign chip equipment builders will want to be left out of the opportunities in China. Top executives from three of the five biggest global chip equipment builders -- Applied Materials, Lam Research and Tokyo Electron -- attended SEMICON China.

    Gary Dickerson, chief executive of Applied Materials, the world's biggest chip equipment provider, took the opportunity to make his first clear public statement related on the trade war, saying, "The strained relationship between China and the U.S. can put decades of economic growth at risk."

    He warned it would be "a lose-lose proposition" if the world's two biggest economic power were unable to get along.

    "Very few business executives could resist the vast opportunities in the world's largest semiconductor market," said Foxsemicon's Hwang. "I think most of them would try to strike a balance between the world's two biggest economies by investing both in the U.S. and China."
     
  2. Hendrik_2000
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    我科学家另辟蹊径造出9纳米光刻试验样机
    scientists have taken a different approach to create a 9-nm lithography test prototype
    2019-04-12 14:45:45 来源: 科技日报 作者: 刘志伟


    China Science and Technology network · Science and Technology Daily News (reporter zhiwei)April 10 reporter from Wuhan optoelectronics National Research Center learned that the center Gan Brown Pine Team using two-beam laser in self-developed photoresist to break the limit of the light diffraction, the use of far-field optics, lithography out of the minimum 9 nanowires wide line segment, The major innovations from ultra-resolution imaging to ultra-diffraction limit lithography manufacturing are realized.

    Lithography machine is the key equipment in the process of integrated circuit manufacturing, the mainstream deep ultraviolet ( DUV) and extremely ultraviolet (EUV) photoresists are mainly produced by the Dutch ASML company, belonging to the domestic integrated circuit manufacturing industry "neck" technology. 2009 Gan Brown Pine Team follows Nobel laureate in chemistry, German scientist Stefan · The basic principle of W. Hull's ultra-resolution fluorescence imaging, in the absence of any technology to draw on, has opened up a new path of light manufacturing.

    The dual-light Super-emission limit lithography technology is completely different from the current mainstream integrated circuit photoresist to continuously reduce the lithography wavelength, from the 193 nanometer wavelength of deep ultraviolet (DUV) transition to 13.5 Nanometer wavelength of extreme ultraviolet ( EUV ) Of the technical route. The Gan Brown pine team uses photoresist materials to produce different photochemical reactions to different wavelength beams, which, after careful design, Enable self-developed photoresist to produce curing under the first wavelength of the laser beam, in the second wavelength of the laser beam to destroy the curing; the second beam is made into a central light intensity of Zero hollow light and the first beam of light to form a coincident spot, while acting on the gelatin, so only the second beam of light Center hollow part of the photoresist is eventually cured , Thus breaking through the diffraction limit in the far field .

    Since it was verified by Gan Tan in 2013, the technical principle has been faced with the development difficulties from the principle verification prototype to the commercially available engineering prototype. After more than 2 years of engineering technology development, the team overcame three problems, such as the localization of materials, software and components . A variety of photoresist, including organic resins, semiconductor materials, metals and so on, has been developed to solve the problem of single type of photoresist supporting the technology with a more universal dual-beam ultra-resolution lithography principle. Realize the integration of micro-three-dimensional device structure design and manufacturing software, can be unattended intelligent manufacturing.

    At the same time, through cooperation to achieve the prototype system key components including femtosecond lasers, focused objective lenses and other localization, in the whole machine equipment to verify that domestic components have or even surpass the performance of similar products abroad. At present, the dual-optical Super limit lithography system is mainly used in the three-dimensional optical manufacturing of micro-NA devices, and with the further improvement of equipment performance in the future, the technology will be expected to be applied to integrated circuit manufacturing after solving the key problems such as manufacturing speed. The most important thing, says gan Brown Pine, is that we break The foreign technology monopoly of three- dimensional micro-light manufacturing , in this field, from materials, software to optical and electromechanical parts..

    http://stdaily.com/02/difangyaowen/2019-04/12/content_760318.shtml
    我科学家另辟蹊径造出9纳米光刻试验样机-地方要闻-区域创新
    作者:
    4-5 minutes

    中国科技网·科技日报讯(记者刘志伟)4月10日记者从武汉光电国家研究中心获悉,该中心甘棕松团队采用二束激光在自研的光刻胶上突破了光束衍射极限的限制,采用远场光学的办法,光刻出最小9纳米线宽的线段,实现了从超分辨成像到超衍射极限光刻制造的重大创新。

    光刻机是集成电路生产制造过程中的关键设备,主流深紫外(DUV)和极紫外(EUV)光刻机主要由荷兰ASML公司垄断生产,属于国内集成电路制造业的“卡脖子”技术。2009年甘棕松团队遵循诺贝尔化学奖得主德国科学家斯特凡·W·赫尔的超分辨荧光成像的基本原理,在没有任何可借鉴的技术情况下,开拓了一条光制造新的路径。

    双光束超衍射极限光刻技术完全不同于目前主流集成电路光刻机不断降低光刻波长,从193纳米波长的深紫外(DUV)过渡到13.5纳米波长的极紫外(EUV)的技术路线。甘棕松团队利用光刻胶材料对不同波长光束能够产生不同的光化学反应,经过精心的设计,让自主研发的光刻胶能够在第一个波长的激光光束下产生固化,在第二个波长的激光光束下破坏固化;将第二束光调制成中心光强为零的空心光与第一束光形成一个重合的光斑,同时作用于光刻胶,于是只有第二束光中心空心部分的光刻胶最终被固化,从而远场突破衍射极限。

    该技术原理自2013年被甘棕松等验证以来,一直面临从原理验证样机到可商用化的工程样机的开发困难。团队经过2年的工程技术开发,分别克服了材料,软件和零部件国产化等三个方面的难题。开发了综合性能超过国外的包括有机树脂、半导体材料、金属等多类光刻胶,采用更具有普适性的双光束超分辨光刻原理解决了该技术所配套光刻胶种类单一的问题。实现了微纳三维器件结构设计和制造软件一体化,可无人值守智能制造。

    同时通过合作实现了样机系统关键零部件包括飞秒激光器、聚焦物镜等的国产化,在整机设备上验证了国产零部件具有甚至超越国外同类产品的性能。双光束超衍射极限光刻系统目前主要应用于微纳器件的三维光制造,未来随着进一步提升设备性能,在解决制造速度等关键问题后,该技术将有望应用于集成电路制造。甘棕松说,最关键的是,我们打破了三维微纳光制造的国外技术垄断,在这个领域,从材料、软件到光机电零部件,我们都将不再受制于人。

    责任编辑:值班主任


    prototype
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    NAURA announced R&D invesmet of 2.1 billion yuan to enter the 7/5nm semiconductor manufacturing equipment market https://www.expreview.com/68133.html
    Domestic manufacturers entered the 7nm, 5nm semiconductor manufacturing equipment market, investing 2.1 billion R & D - super Meng Xianrui network of 6-7 minutes of domestic manufacturers to enter the 7nm, 5nm semiconductor manufacturing equipment market, R & D investment and 2.1 billion 2019-4-24 18:15 | author: Meng Xianrui | keywords: North CRE, semiconductor, etching machine, 5nm 7nm domestic semiconductor equipment manufacturer

    Zhonghua Huachuang has developed well in recent years and has been able to provide 28nm process manufacturing equipment. The company today released its 2018 annual report, with revenue of 3.32 billion yuan, a 50% year-on-year increase, and a net profit growth of 86%. In addition, the company also announced a fundraising of 2.1 billion yuan, mainly for the next generation of semiconductor manufacturing equipment research and development, focusing on 7nm, 5nm process semiconductor manufacturing equipment.
    In the field of semiconductors, most people are concerned about "stars" such as nm processes, memory chips, lithography machines, etc. However, as far as the domestic semiconductor industry as a whole is concerned, in addition to the lack of advanced technology, domestically rely heavily on semiconductor manufacturing equipment. Foreign manufacturers, although China is already the world's second largest semiconductor equipment market, but in this field,

    US Applied Materials, KLA Kelei Semiconductor is the world's leading manufacturer, domestic semiconductor manufacturers are still inseparable from these manufacturers. The domestic semiconductor equipment manufacturer Zhonghua Huachuang has developed well in recent years and has been able to provide 28nm process manufacturing equipment. The company today released its 2018 annual report, with revenue of 3.32 billion yuan, a 50% year-on-year increase, and a net profit growth of 86%.
    In addition, the company also announced a fundraising of 2.1 billion yuan, mainly for the next generation of semiconductor manufacturing equipment research and development, focusing on 7nm, 5nm process semiconductor manufacturing equipment. We used to sell the CPU in the sand, why sell it so expensive? The super-energy class article describes the manufacturing process of semiconductor chips in detail.

    Among them, photolithography is the most important, which determines the process technology of the chip. The cost is also the highest , which can account for about 1/3 of the manufacturing cost.
    However, in addition to lithography, semiconductor manufacturing has other complicated processes, including etching, cleaning, ion implantation, grinding, etc. The equipment produced by North Huachuang involves etching machine, PVD physical vapor deposition, CVD chemical vapor deposition, and thin film equipment. , cleaning equipment, etc. According to the official introduction,

    North Huachuang is mainly engaged in the research and development, production, sales and technical services of basic electronic products. The main products are electronic process equipment and electronic components. It is a domestic mainstream high-end electronic technology equipment supplier, and is also an important high-precision, high-tech Reliable electronic components production base.

    The main products of electronic process equipment include semiconductor equipment, vacuum equipment and lithium battery equipment. They are widely used in integrated circuits, semiconductor lighting, power devices, MEMS, advanced packaging, photovoltaic materials and batteries, flat panel displays, vacuum electronics, New materials, lithium-ion batteries and other fields.

    The main products of electronic components include high-precision electronic components such as resistors, capacitors, crystal devices, microwave components, module power supplies, hybrid integrated circuits, etc., which are widely used in high-precision, precision and sharp special industries such as precision instrumentation and automatic control. Today, North Huachuang released its annual report for 2018. The annual revenue was 3.324 billion yuan, a year-on-year increase of 49.53%. The net profit of the main company was 234 million yuan, an increase of 86.05%. The net profit of non-home return was 76 million yuan, a year-on-year increase of 136.77%.
    At present, electronic process equipment has become the main revenue of North Huachuang. The revenue in 2018 was 2.521 billion yuan, an increase of 75.7% year-on-year, accounting for more than 75%.
    At the technical level, 28 nanometer equipment supply capability has been formed in the field of integrated circuits, 14 nanometer process equipment has entered the customer process verification stage, 12 吋 etching machine, PVD, ALD, monolithic annealing system and LPCVD equipment have entered the mainstream of integrated circuits. factory.

    In addition, North China Ventures also raised 2.1 billion yuan through funds and other channels at the beginning of this year, mainly for the development of new generation semiconductor equipment, mainly to build integrated circuit equipment innovation center building and purchase 5/7nm key test equipment and build test and verification platform. Developed 5/7nm key integrated circuit equipment and realized industrial application. It is expected to realize 30 sets of annual etching equipment, 30 sets of PVD equipment, 15 sets of single-piece annealing equipment, 30 sets of ALD equipment, and 30 sets of vertical furnace equipment. 30 sets of cleaning equipment; the industrialization of high-precision electronic components is expected to increase by 241.96 million yuan, mainly to achieve an annual output of 58,000 modules.
     
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    SMIC is working with customers on 12nm trial production

    中芯国际宣布12纳米进入客户导入阶段

    2019年05月09日 19:54 芯智讯


    摘要:5月8日晚间,中芯国际(00981.HK)发布了2019年第一季度报告。报告期内,公司实现营收6.69亿美元,同比下降19.5%;实现利润2437.7万美元,同比下降10%。公司预计第二季度的收入环比增加17%至19%,毛利率介于18%至20%的范围内。

    5月8日晚间,中芯国际(00981.HK)发布了2019年第一季度报告。报告期内,公司实现营收6.69亿美元,同比下降19.5%;实现利润2437.7万美元,同比下降10%。公司预计第二季度的收入环比增加17%至19%,毛利率介于18%至20%的范围内。

    中芯国际联席首席执行官,赵海军博士和梁孟松博士评论说:“过去两年以来,公司处于调整期。透过优化和改革,提升内在实力,研发显著提速。我们积蓄的能量和竞争力,将加速我们接下来追赶产业发展新趋势的步伐,迎合宏观市场机会的到来,有望走出调整期,加速我们的成长。”

    中芯国际联席首席执行官,赵海军博士表示:“我们看到一季度为今年营收低谷,产业库存周期调整结束,中芯努力耕耘的新成熟工艺平台也准备就绪,模拟与电源管理芯片,CMOS射频与物联网芯片等新应用带动业绩成长。二季度收入预计环比上升17%~19%。”

    中芯国际联席首席执行官,梁孟松博士表示:“FinFET研发进展顺利,12nm工艺开发进入客户导入阶段,下一代FinFET研发在过去积累的基础上进度喜人。上海中芯南方FinFET工厂顺利建造完成,开始进入产能布建。我们将为快速契合客户的技术迁移做好准备,以面对日新月异的行业环境。”
    Re: Chinese Semiconductor Industry Thread « Reply #892 on: May 12, 2019, 10:04:26 AM » Quote SMIC is working with customers on 12nm trial production SMIC announces 12nm entry into customer introduction phase

    May 09, 2019 19:54 Core Intelligence Summary: On the evening of May 8, SMIC (00981.HK) released its first quarterly report for 2019. During the reporting period, the company achieved revenue of US$669 million, down 19.5% year-on-year; realized profit of US$24.377 million, down 10% year-on-year.

    The company expects revenue in the second quarter to increase by 17% to 19% quarter-on-quarter, with gross margins ranging from 18% to 20%. On the evening of May 8, SMIC (00981.HK) released its first quarterly report for 2019. During the reporting period, the company achieved revenue of US$669 million, down 19.5% year-on-year; realized profit of US$24.377 million, down 10% year-on-year.

    The company expects revenue in the second quarter to increase by 17% to 19% quarter-on-quarter, with gross margins ranging from 18% to 20%. SMIC's co-CEO, Dr. Zhao Haijun and Dr. Liang Mengsong commented: "In the past two years, the company has been in an adjustment period.

    Through optimization and reform, the internal strength is enhanced, and research and development is significantly accelerated. Our energy and competitiveness will be saved. Accelerating our pace to catch up with new trends in industrial development, catering to the arrival of macro market opportunities, is expected to step out of the adjustment period and accelerate our growth.”

    SMIC International Co-CEO, Dr. Zhao Haijun said: “We saw the first quarter for this year. The revenue is low, the industrial inventory cycle is over, SMIC is working hard to develop a new mature technology platform, simulation and power management chips, CMOS RF and IoT chips and other new applications drive performance growth.

    Second quarter revenue is expected to increase by 17% ~19%." SMIC's co-CEO, Dr. Liang Mengsong said: "FinFET research and development is progressing smoothly, 12nm process development has entered the customer introduction stage, and the next-generation FinFET R&D has been progressing on the basis of past accumulation. Shanghai SMIC Southern FinFET Factory Smooth construction completed and began to enter capacity. I We will be prepared to quickly adapt to the customer's technology migration to face the ever-changing industry environment."
     
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    I read the MSM about Huawei they all ignoring Huawei backup chip design instead they say Huawei will use their inventory that will soon run out Yeah you wish
    Anyway a vote of confidence from Samsung they will invest 14 billion dollar in new Chip making facility in Xian via long

    Samsung to invest over 14 bln dollars in China chip plant
    Source: Xinhua| 2019-05-17 19:42:24|

    XI'AN, May 17 (Xinhua) -- Total investment by Samsung in the second phase of its chip plant in Xi'an, capital of northwest China's Shaanxi Province, will exceed 14 billion U.S. dollars, sources with Samsung China Semiconductor Co. Ltd. said Friday.

    The construction of the second phase of Samsung's chip plant in Xi'an started in March 2018 and will be completed in July. It is expected to begin mass production in the first quarter of 2020, according to the company.

    Hyunki Ji, vice president of Samsung China Semiconductor Co. Ltd., said the chip plant project consisted of two stages. During the first stage, the company invested a total of 7 billion U.S. dollars. Though the detailed plan of the second stage has not been rolled out, investment is estimated to surpass 7 billion U.S. dollars.

    The investment in the second phase of chip plant project reflects Samsung's confidence in China's economy, according to Hyunki Ji.

    Samsung signed an agreement with the Shaanxi Provincial Government on Aug. 30, 2017 to start the second phase of the chip plant to expand chip production capacity.

    The first phase of the plant at the Xi'an Hi-Tech Industries Development Zone went into operation in May 2014, with a total investment of 10 billion U.S. dollars.

    The opening of Samsung's semiconductor project has attracted more than 100 supporting companies to the zone, and its expanded capacity is expected to strengthen Xi'an's role as a major semiconductor industry base.
     
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    This chip should improve the accuracy of Chinese missile via Taishang
    China's UniStrong Sci-Tech Unveils First All-Beidou-3-Satellite-Signal Chip

    DOU SHICONG
    DATE : MAY 21 2019/SOURCE : YICAI

    [​IMG]
    China's UniStrong Sci-Tech Unveils First All-Beidou-3-Satellite-Signal Chip

    (Yicai Global) May 21 -- Lyra-II, the world's first high-precision baseband chip that supports China's latest-generation Beidou-3 satellite navigation system, officially debuted in Beijing yesterday.

    Devices fitted with the Lyra-II microprocessor will be able to receive all the Beidou-3 system's signals. The wafer's new anti-interference technology can detect and suppress interfering signals, UniStrong explained at the launch conference.

    The company's shares [SHE:002383] hit the 10 percent limit up bourse rules impose after today's opening to close at CNY12.7 (USD1.8) on the chip's release

    Beijing-based navigation technology developer UniStrong Science & Technology spent over CNY50 million (USD7.2 million) and two years of research and development on Lyra-II and achieved mass production last month in a development that will boost the commercial application of China's self-developed satellite system.

    Terminals equipped with the chip are expected to come out in August this year, online news portal China News reported.

    Beidou-3 completed basic system construction and began to beam information at the end of last year. Its signal now reaches 3 billion people in over 50 countries and is expected to achieve full global coverage by next year.

    A baseband processor is a device in a network interface that handles all radio functions.

    https://www.yicaiglobal.com/news/ch...eils-first-all-beidou-3-satellite-signal-chip

    @han Patriot
     
  7. Quickie
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    Quickie Captain

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    The development of the EM catapult probably goes hand in hand with that of the Maglev Train.

    http://www.xinhuanet.com/english/2019-05/23/c_138082738.htm
    China unveils 600 kph maglev train prototype
    Source: Xinhua| 2019-05-23 13:03:49|Editor: Liangyu


    QINGDAO, May 23 (Xinhua) -- China on Thursday rolled off the production line a prototype magnetic-levitation train with a designed top speed of 600 km per hour in the eastern city of Qingdao.

    The debut of China's first high-speed maglev train testing prototype marks a major breakthrough for the country in the high-speed maglev transit system.

    The testing prototype can check and optimize the key technologies and core system components of the high-speed maglev system and lay a technological basis for the forthcoming engineering prototype, said Ding Sansan, head of the train's research and development team and deputy chief engineer of CRRC Qingdao Sifang Co., the train builder.

    "Now the prototype has achieved static levitation and is in good condition," Ding said.

    The train builder is currently building an experimental center and a trial production center for the high-speed maglev trains and expected to put them into operation in the second half of the year, he said.

    The research and development of a five-carriage engineering prototype are going smoothly.

    The engineering prototype is scheduled to roll off the production line in 2020 and go through comprehensive tests to finish integrated verification in 2021.
     
  8. Hendrik_2000
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    Hendrik_2000 Brigadier

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    Konka to Build USD4.4 Billion Microchip Base in Chongqing
    TANG SHIHUA
    DATE : JUN 14 2019/SOURCE : YICAI
    Via Jsch
    [​IMG]
    Konka to Build USD4.4 Billion Microchip Base in Chongqing

    (Yicai Global) June 14 -- Chinese electronics maker Konka Group is planning to build a CNY30 billion (USD4.4 billion) semiconductor and photoelectric industrial park in the southwestern Chinese megacity of Chongqing with investment of up to CNY7.5 billion in the project's first phase.

    The Shenzhen-based company recently signed a framework agreement and investment contract with the government of the city's Bishan district to this end, the major Chinese television maker announced yesterday.

    Konka and other firms that will settle in the industrial park will jointly finance it, the announcement said, but without going into further details as to the project.

    Formed in 1980 and under the umbrella of state-backed tourism, real estate and paper packaging conglomerate Shenzhen Overseas Chinese Town, Konka was China's first Sino-foreign joint-venture electronics company to form after the advent of the country's reform and opening in 1978.

    It has been undergoing a shift lately from being a producer of conventional electronics to a maker of microprocessors and says it will need from five to 10 years to ascend to the front rank of international chip manufacturers.

    The company has also penned an agreement with Hefei, the capital of China's eastern Anhui province, to invest in and build a silicon wafer industrial park there to attract semiconductor design firms and to form an integrated circuit industrial chain.
     
    Equation and manqiangrexue like this.
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