Chinese semiconductor industry

Discussion in 'Members' Club Room' started by Hendrik_2000, Apr 14, 2019.

  1. Hendrik_2000
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    Hendrik_2000 Brigadier

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    I think it is about time to create a separate thread for this important segment of industry Here is the first post
    As I said before all this talk of embargo for semiconductor equipment will only spur the development of domestic semi equipment. Now all the chip maker in China is more willing to use domestic equipment and research and development of semi equipment is growing fast


    https://asia.nikkei.com/Business/Ch...es-China-s-chip-equipment-makers-room-to-grow

    CHINA TECH
    Trade war gives China's chip equipment makers room to grow
    Beijing plays down its ongoing semiconductor ambitions amid U.S. push back

    CHENG TING-FANG, Nikkei staff writer
    APRIL 11, 2019 17:16 JST

    Demand from domestic companies is expected to give a lift to China's chip industry ambitions.
    SHANGHAI/TAIPEI -- China's chip equipment makers are seeing an uptick in domestic demand thanks to the trade war, giving them an opportunity to finally gain ground on global rivals like Applied Materials and Tokyo Electron.

    Beijing-backed startup Skyverse says it will start selling its chip testing technology to major Chinese chipmakers this year, a development that Marketing Manager Leo He attributes at least partly to the trade tensions with the U.S.

    "We found that more local chip manufacturers are willing to test and try our products especially after the trade tensions escalated last year," He told the Nikkei Asian Review. "They are really keen to use domestic offerings once we can provide them. ... That's something we did not feel years ago."


    Other Chinese companies, including state-backed Naura Technology, Advanced Micro-Fabrication Equipment and Mattson Technology, also told the Nikkei Asian Review that local chipmakers have become more willing to try their products in recent months.

    While industry players acknowledge that many Chinese companies still have a long way to go in terms of technical capability, the nascent shift toward domestic equipment underscores the importance that the government is placing on the sector as a whole.

    The shift also comes as China is predicted to buck the global downturn in the chip market. Industry revenue in China, including foreign players operating in the country, is predicted to grow by more than 16%, compared with a possible global decline of 3%.

    Skyverse, founded in 2014 by scientist Chen Lu, is backed by SDIC Venture Capital, the Beijing-sponsored flagship financing program controlled by State Development and Investment Corp. The company aims to take on KLA-Tencor of the U.S., the world's biggest semiconductor testing tool provider.

    It plans to begin mass producing its chip testing tool this year. Yangtze Memory Technologies, a state-backed memory chipmaker that aims to challenge Samsung and Micron, will adopt the equipment, according to He, as will two other top local companies, Semiconductor Manufacturing International Co. and Huali Microelectronics. "It will be a landmark year for us in 2019," He said.

    China made fostering a domestic chip industry a top policy priority in 2014, after the Edward Snowden leaks the previous year revealed connections between U.S. companies and American intelligence agency's vast surveillance program.

    Only recently, however, has Beijing begun seriously supporting the nascent homegrown semiconductor equipment sector. Most resources previously went to building massive chip plants or assisting chip developers.


    This year's SEMICON China event in Shanghai drew a record 100,000 participants. (Photo by Cheng Ting-fang)
    Industry sources familiar with the matter say the big change came when the U.S. suddenly cut off supplies for telecom equipment maker ZTE and state-backed memory chipmaker Fujian Jinhua Integrated Circuit.

    The optimistic outlook for companies like Skyverse highlights not only China's ambitions, but also how far the country still has to go in terms of reducing its reliance on foreign suppliers.

    China currently has no notable players that can match the technology offerings of chip equipment titans like Applied Materials, Lam Research, KLA-Tencor, Tokyo Electron and ASML. None of the world's chip manufacturers -- including market leaders Samsung, Intel and Taiwan Semiconductor Manufacturing Co. -- would be able to produce integrated circuits without these vendors' wide range of advanced wafer-processing tools.

    Because chips are used in almost every electronic devices from smartphones to servers to connected cars and are closely connected to national security, the equipment required to produce them are also viewed as crucial weapons in the tech battle between the U.S. and China.

    "Chip equipment and materials are the segments that really take time to build," Allen Lu, president and CEO of semiconductor tool provider Mattson, told Nikkei. "Chinese semiconductor equipment makers accounted for less than 2% of the global market. ... There's still a very far way to go."

    Still, Mattson is keen to catch up. The company was acquired by a Chinese state fund in 2016, and it nearly doubled its research and development investment in 2018 to around $40 million.

    Mattson, too, sees the trade war as a positive in terms of winning local customers, according to Marketing Director Andy Zhang. "We think it's natural for local chip producers to use more domestic equipment, and we do find it's easier to approach them because of the uncertainties brought by the trade tension, and the government would definitely support this incentive, too," he said. He noted, however, that quality is still the deciding factor in success. "At the end of the day, it's only the quality of the equipment that really determines whether you can get the business deal."

    The trade war and a slowing smartphone market have hampered global chip demand, with the market predicted to decline 3% this year, according to the latest forecast by World Semiconductor Trade Statistics, one of the industry's best-known data providers.

    China remains a bright spot, however, with the domestic chip industry predicted to grow 16.2% in terms of revenue, according to data from Taipei-based research company TrendForce.

    Expectations for the Chinese market were reflected at the annual SEMICON China in Shanghai in late March, which attracted a record 100,000 industry executives and professionals.

    China is the world's biggest consumer of semiconductors, as well as the second-largest chip equipment market worldwide, behind only South Korea.

    Nevertheless, the country still imported $312 billion worth of chips in 2018 -- its top import for the year.


    Ding Wen-Wu, head of China Integrated Circuit Industry Investment Fund, the nation's top chip financing program nicknamed "the Big Fund" -- said this indicates how dependent the nation remains on foreign supplies.

    "It's still very challenging to our country as we work to become more self-reliant," Ding added.

    Ding said China needs to acknowledge the "big technology gap" between its homegrown chip players and their leading foreign peers in the U.S., Europe, South Korea and Japan. His fund, he added, is ready to welcome foreign players that want to participate in China's "buoyant and developing" semiconductor industry.

    Many foreign and domestic industry executives said Beijing has taken a slightly less aggressive tone in its public responses to the U.S. crackdown on China's tech ambition. Nevertheless, they say, the central and local governments have never scaled back their support for local chip projects.

    Jackson Hwang, co-founder and chief strategy officer of Foxsemicon Integrated Technology, a Foxconn unit making chip equipment parts for foreign customers like Applied Materials, said: "The trade tension between the world's two big powers has pushed China to be more determined than ever to build a self-reliant industry."

    "The supports from Chinese governments have never been so strong in making utilities [and] land ready and to attract more talent globally after the prolonged trade tension ... That's how I feel currently," Hwang said. Foxsemicon is currently building a new campus and logistics center in the Chinese city of Nanjing slated to begin production by the second half of next year.

    Given the global downturn, few foreign chip equipment builders will want to be left out of the opportunities in China. Top executives from three of the five biggest global chip equipment builders -- Applied Materials, Lam Research and Tokyo Electron -- attended SEMICON China.

    Gary Dickerson, chief executive of Applied Materials, the world's biggest chip equipment provider, took the opportunity to make his first clear public statement related on the trade war, saying, "The strained relationship between China and the U.S. can put decades of economic growth at risk."

    He warned it would be "a lose-lose proposition" if the world's two biggest economic power were unable to get along.

    "Very few business executives could resist the vast opportunities in the world's largest semiconductor market," said Foxsemicon's Hwang. "I think most of them would try to strike a balance between the world's two biggest economies by investing both in the U.S. and China."
     
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  2. Hendrik_2000
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    Via xyz

    我科学家另辟蹊径造出9纳米光刻试验样机
    scientists have taken a different approach to create a 9-nm lithography test prototype
    2019-04-12 14:45:45 来源: 科技日报 作者: 刘志伟


    China Science and Technology network · Science and Technology Daily News (reporter zhiwei)April 10 reporter from Wuhan optoelectronics National Research Center learned that the center Gan Brown Pine Team using two-beam laser in self-developed photoresist to break the limit of the light diffraction, the use of far-field optics, lithography out of the minimum 9 nanowires wide line segment, The major innovations from ultra-resolution imaging to ultra-diffraction limit lithography manufacturing are realized.

    Lithography machine is the key equipment in the process of integrated circuit manufacturing, the mainstream deep ultraviolet ( DUV) and extremely ultraviolet (EUV) photoresists are mainly produced by the Dutch ASML company, belonging to the domestic integrated circuit manufacturing industry "neck" technology. 2009 Gan Brown Pine Team follows Nobel laureate in chemistry, German scientist Stefan · The basic principle of W. Hull's ultra-resolution fluorescence imaging, in the absence of any technology to draw on, has opened up a new path of light manufacturing.

    The dual-light Super-emission limit lithography technology is completely different from the current mainstream integrated circuit photoresist to continuously reduce the lithography wavelength, from the 193 nanometer wavelength of deep ultraviolet (DUV) transition to 13.5 Nanometer wavelength of extreme ultraviolet ( EUV ) Of the technical route. The Gan Brown pine team uses photoresist materials to produce different photochemical reactions to different wavelength beams, which, after careful design, Enable self-developed photoresist to produce curing under the first wavelength of the laser beam, in the second wavelength of the laser beam to destroy the curing; the second beam is made into a central light intensity of Zero hollow light and the first beam of light to form a coincident spot, while acting on the gelatin, so only the second beam of light Center hollow part of the photoresist is eventually cured , Thus breaking through the diffraction limit in the far field .

    Since it was verified by Gan Tan in 2013, the technical principle has been faced with the development difficulties from the principle verification prototype to the commercially available engineering prototype. After more than 2 years of engineering technology development, the team overcame three problems, such as the localization of materials, software and components . A variety of photoresist, including organic resins, semiconductor materials, metals and so on, has been developed to solve the problem of single type of photoresist supporting the technology with a more universal dual-beam ultra-resolution lithography principle. Realize the integration of micro-three-dimensional device structure design and manufacturing software, can be unattended intelligent manufacturing.

    At the same time, through cooperation to achieve the prototype system key components including femtosecond lasers, focused objective lenses and other localization, in the whole machine equipment to verify that domestic components have or even surpass the performance of similar products abroad. At present, the dual-optical Super limit lithography system is mainly used in the three-dimensional optical manufacturing of micro-NA devices, and with the further improvement of equipment performance in the future, the technology will be expected to be applied to integrated circuit manufacturing after solving the key problems such as manufacturing speed. The most important thing, says gan Brown Pine, is that we break The foreign technology monopoly of three- dimensional micro-light manufacturing , in this field, from materials, software to optical and electromechanical parts..

    http://stdaily.com/02/difangyaowen/2019-04/12/content_760318.shtml
    我科学家另辟蹊径造出9纳米光刻试验样机-地方要闻-区域创新
    作者:
    4-5 minutes

    中国科技网·科技日报讯(记者刘志伟)4月10日记者从武汉光电国家研究中心获悉,该中心甘棕松团队采用二束激光在自研的光刻胶上突破了光束衍射极限的限制,采用远场光学的办法,光刻出最小9纳米线宽的线段,实现了从超分辨成像到超衍射极限光刻制造的重大创新。

    光刻机是集成电路生产制造过程中的关键设备,主流深紫外(DUV)和极紫外(EUV)光刻机主要由荷兰ASML公司垄断生产,属于国内集成电路制造业的“卡脖子”技术。2009年甘棕松团队遵循诺贝尔化学奖得主德国科学家斯特凡·W·赫尔的超分辨荧光成像的基本原理,在没有任何可借鉴的技术情况下,开拓了一条光制造新的路径。

    双光束超衍射极限光刻技术完全不同于目前主流集成电路光刻机不断降低光刻波长,从193纳米波长的深紫外(DUV)过渡到13.5纳米波长的极紫外(EUV)的技术路线。甘棕松团队利用光刻胶材料对不同波长光束能够产生不同的光化学反应,经过精心的设计,让自主研发的光刻胶能够在第一个波长的激光光束下产生固化,在第二个波长的激光光束下破坏固化;将第二束光调制成中心光强为零的空心光与第一束光形成一个重合的光斑,同时作用于光刻胶,于是只有第二束光中心空心部分的光刻胶最终被固化,从而远场突破衍射极限。

    该技术原理自2013年被甘棕松等验证以来,一直面临从原理验证样机到可商用化的工程样机的开发困难。团队经过2年的工程技术开发,分别克服了材料,软件和零部件国产化等三个方面的难题。开发了综合性能超过国外的包括有机树脂、半导体材料、金属等多类光刻胶,采用更具有普适性的双光束超分辨光刻原理解决了该技术所配套光刻胶种类单一的问题。实现了微纳三维器件结构设计和制造软件一体化,可无人值守智能制造。

    同时通过合作实现了样机系统关键零部件包括飞秒激光器、聚焦物镜等的国产化,在整机设备上验证了国产零部件具有甚至超越国外同类产品的性能。双光束超衍射极限光刻系统目前主要应用于微纳器件的三维光制造,未来随着进一步提升设备性能,在解决制造速度等关键问题后,该技术将有望应用于集成电路制造。甘棕松说,最关键的是,我们打破了三维微纳光制造的国外技术垄断,在这个领域,从材料、软件到光机电零部件,我们都将不再受制于人。

    责任编辑:值班主任


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