Picking some interesting part from the tear down's
(just 2 pictures here, the others are on the link)
View attachment 129319
View attachment 129320
We can see that the only non mainland China suppliers are Taiwan's
for battery charger,
Bosch for accelerometer & gyroscope and
SK Hynix for DRAM.
The RF front-end IC are marked HiSilicon, but it would be interesting to know who is the foundry and also who are the suppliers of the SAW/BAW filters, PA amplifiers and all the other front end analog stuff.
All in all an impressive supply chain engineering effort by Huawei. I'm not sure people understand what it means to raise a whole bunch of new suppliers to world-class flagship product level.
IMO this is the biggest contribution of Huawei to China.
Regarding memory, I don't fully buy this narrative of SK Hynix DRAM chips still from 2020 stockpile...anyhow I have no data here. I just have some doubts....maybe HW still has
some old DRAM chip to use at product launch, when specialized firms get their sample to tear-down. I think we will hear more on that in the future...
Anyhow DRAM IC in this sample is confirmed to be like in the Mate 60, the H58GG6MK6G
LPDDR5-6400, still not a LPDDR5X....we are well in CXMT territory. That SK Hynix chip can turn into a CXMT quite quickly if needed.
Regarding the tear-down, this firm IFixit, does not have the advanced instrumentation to perform a deep chip analysis at transistor level. That's why they have no clues about NAND and the other HiSilicon chips. TechInsights has the instrumentation, but for some reason their analysis has been classified.